Bridging the Frontier 
Bob Smith, Executive Director
Bob Smith is Executive Director of the ESD Alliance responsible for its management and operations. Previously, Bob was senior vice president of Marketing and Business Development at Uniquify, responsible for brand development, positioning, strategy and business development activities. Bob began his … More » A Busy December with REUSE 2016, Updates to Multi-Die IC Design Guide, New Member OutreachNovember 22nd, 2016 by Bob Smith, Executive Director
While 2016’s coming to an end, it’s not quite over yet and the month of December will be busy for the ESD Alliance. Our industry has one brand new event called REUSE 2016 that will take place Thursday, December 1. The ESD Alliance will be there, along with close to 40 other exhibitors. REUSE 2016 is the first of an annual conference and trade show to bring together the semiconductor IP supply chain and its customers for a full day of everything to do with semiconductor IP. It will be held from 11 a.m. until 8 p.m. at the Computer History Museum in Mountain View, Calif. Admission is free. I’m moderating a conversation during REUSE with Lucio Lanza, managing director of Lanza techVentures, and Dan Rubin, general partner of Alloy Ventures. We’ll talk about the semiconductor IP market and IoT during the discussion titled, “IoT: Poised to offer huge growth opportunities for the global IP Business.”
Lucio and Dan were key figures in the early days of IP through their association with Artisan Components. They have great stories from those days when VLSI Libraries became Artisan Components, (acquired by ARM long ago), and the decision to the switch to the royalty business model. Looking back, both seem like significant moves that re-imagined the market. We plan to talk about those changes and the industry’s move to higher levels of abstraction with a more “stack-and-glue” approach. Our discussion will be held from 4 p.m. to 4:30 p.m. I hope to see you at what promises to be an interesting day of exhibits, presentations and thought-provoking discussions. REUSE 2016 registration can be found here. The Multi-Die IC Design Guide We’re in the midst of editing and compiling the next edition of the Multi-Die IC Design Guide, a yearly comprehensive collection of information about multi-die IC design. The 500-page guide includes background information on the technologies, trends, definitions and real-world examples. It will have a section with supplier content and technical papers on multi-die solutions that ranges from design –– automation, analysis and modeling solutions –– to manufacturing with specifics on packaging and manufacturing solutions. The current edition introduced at DAC 2016 has been downloaded by more than 300 people all over the world from a diverse array of companies including many at the Fortune 100. There is clearly a lot of interest in this topic. It is available as a free download here. New Member Program As the year comes to a close, the Alliance is formally kicking off a new member program to expand and grow our membership. We will be actively approaching EDA, IP, design services and embedded startup, small and medium size companies who could benefit from membership in the ESD Alliance. After talking with board members, member companies and several industry consultants, we developed a set of compelling membership benefits for smaller and emerging companies who have a variety of needs and issues that impede their growth. We believe we can offer a valuable service to these companies as part of their membership. If you haven’t heard from me and would like to learn more about joining the ESD Alliance, please don’t wait. Contact me at bob@esd-alliance.org The ESD Alliance website address is: www.esd-alliance.org |
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