Today’s prediction comes from Ravi Ravikumar, Vice President of Marketing at ICScape Inc. Ravi, who has over 18 years of experience in marketing, business development & project/program management in the EDA and semiconductor industries, gives his two cents on timing and power closure for 2013…..
“If you think timing and power closure were difficult issues at 40 and 28nm, they are going to get worse at 20nm. The traditional means of addressing timing/power closure as a post-implementation step using custom scripts that call on sign-off STA and physical implementation tools to achieve closure is taking too many iterations at 28nm.
As geometries reduce below 28nm, timing/power are more difficult to close due to design-related complex physical requirements, process and manufacturability issues like double/triple patterning and VT cell spacing rules create more R/C effects, impacting timing and power. Power issues in-turn lead to temperature and reliability problems. Design closure becomes a multi-dimensional task.
