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What's PR got to do with it? ![]() Ed Lee
Ed Lee has been around EDA since before it was called EDA. He cut his teeth doing Public Relations with Valid, Cadence, Mentor, ECAD, VLSI, AMI and a host of others. And he has introduced more than three dozen EDA startups, ranging from the first commercial IP company to the latest statistical … More » Predictions 2012 – 3D a-comingJanuary 19th, 2012 by Ed Lee
Industry pressure is growing to deliver more mainstream 2.5D and 3D stacked die semiconductor products within the next 1-2 years, driven by the need to improve I/O bandwidth, reduce power consumption, and optimized choice of process technologies for different portions of a complex SoC. It is therefore quite possible that 2012 will see one of the large mainline EDA vendors broadly announce a full “platform” product suite targeting the design of 2.5D and 3D stacked die making use of through-silicon-vias (TSV’s). This design platform would likely incorporate tools from value-added niche vendors, and be endorsed in a large foundry reference flow. Open standards will later expand the range of choice and interoperability over time. Steve Schulz Tags: 2.5D, 2012, 3D, 3D stacked die, EDA, EDA & IP, Electronic Design Automation, I/0, Lee PR, semiconductors, Si2, Standards, TSV, www.leepr.com |