Open-Silicon to Exhibit and deliver two Tech Talks at IP SoC 2016, Bangalore on Wednesday, April 6, 2016
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Open-Silicon to Exhibit and deliver two Tech Talks at IP SoC 2016, Bangalore on Wednesday, April 6, 2016

Open-Silicon, a system optimized ASIC solutions provider, will be exhibiting and delivering two tech talks at the D&R IP SoC 2016, Bangalore. Company will make two technical presentations on “IoT ASIC Platform” and “HBM IP Subsystem Ecosystem”. Besides tech talks company will also be demonstrating it’s IoT ASIC Platform and HMC 2.0 Memory Controller ASIC IP. Visit our booth on exhibit floor to view the demos and to learn about our company’s other ASIC solutions including HBM IP, Interlaken IP.


  1. IoT ASIC Platform- This demonstrates end-to-end communication between sensor hubs and cloud platform through a gateway device. Depending upon the type of radio technology, the sensor hubs can be used outdoors, on the factory floor or inside a room. The Industrial IoT system setup is a part of Open-Silicon’s Spec2Chip IoT Platform, which allows IoT ASIC designs to be evaluated at system level.
  2. HMC 2.0 Memory Controller ASIC IP- This IP demo will showcase a platform based on Xilinx Virtex-7 XC7VX690T FPGA that includes a fully validated design that integrates HMC controller along with HMC exerciser functions. The demo platform allows quick evaluation of the HMC technology and performance testing of the HMC links.


Comprehensive HBM Gen2 IP Sub-system Solution. The solution is now available for 2.5D ASIC design starts and also as licensable Intellectual Property (IP). Open-Silicon’s IP is fully complies with the HBM-Gen2 JEDEC® standard. The IP translates user requests into HBM command sequences (ACT, Pre-Charge) and handles memory refresh, bank/page management and power management on the interface. The IP includes the PHY and custom die-to-die IO needed to drive the interface between the logic-die and the memory die-stack on the 2.5D Interposer.

Tech Talks:

Open-Silicon will present on following two topics in the conference:

  1. Topic:  ”HBM IP Subsystem Ecosystem”
    Time:  14:00 - Session 2a – Interfaces to Subsystem
  2. Topic:  ”IoT ASIC design using Platforms and IP Ecosystem”
    15:45 - Session 3a – Security and IoT

WHEN:  Wednesday, April 6, 2016,
Time: 9:00a.m. – 5:00p.m.

WHERE: Booth on exhibit floor,
Hotel Park Plaza, 90/4,
Outer Ring Road, Marathahalli village,
Bengaluru, Karnataka 560037, India.

About Open-Silicon

Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design – architecture, logic, physical, system, software and IP – and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped over 110 million ASICs to date.  Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world.