TDK Showcases Loadport Innovation and New Features to AFM 15 Flip Chip GGI Die Bonder at SEMICON West 2018

  • Updated AFM 15 for GGI flip chip back end assembly packaging allows for increased die size capability ~ 20mm2, low energy die bonding, a clean lead-free process, with high productivity. High Die I/O attach thermosonic capability is now a reality.
  • PLP, SMIF and open cassette loadports address growing PLP and fab markets.

SAN JOSE, Calif. — (BUSINESS WIRE) — July 2, 2018 — TDK Corporation (TSE: 6762) will present the latest in loadport and chip flip technology at Booth 1905 in the North Hall at the SEMICON West Conference 2018, July 10-12, in the Moscone Center, San Francisco, California.

TDK Corporation product highlights at the show include:

AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder: TDK will feature its AFM GGI flip chip model which includes new horn capability for die sizes up to 10mm2. The TDK horn design provides linear X-Y nozzle movement over a wide range of ultrasonic power settings. Z-axis movement has been reduced by 90 percent during the GGI bonding process. The TDK GGI AFM 15 flip chip attachment process is a clean, lead-free, precision back end assembly process with low cost of ownership and high productivity. The TDK AFM 15 can be used for die interconnect assembly of ASIC, CMOS, MEMS and Opto devices.

TDK 200mm SMIF Loader and Open Cassette Loader for Expanding Fab Growth: The TDK TAS-SMIF and open cassette loadport addresses 200mm fab requirements for low operational costs and cleanliness. It uses a 300mm bolts interface to allow installation using current EFEM design.

A Fab Outlook report from SEMI finds that 200mm fabs opened, under construction and planned will remain above 190 thru 2020. The TDK SMIF and open cassette design uses a base 300mm loadport and 300mm tool software interface. The TDK SMIF cover design provides a clean wafer environment and a TDK option includes manual foot pedal operation and wafer mapping.

TDK TAS PLP Loadport for FO-PLP Panel Level Packaging

According to Yole, the PLP market is expected to grow 51% and reach $285 million by 2023. TDK has more than 18 years of experience with clean precision loadport operation in all major FABs and the TDK TAS-PLP loadport is based upon our proven reliability for FABs. TDK began TAS PLP qualification work in 2016. The TDK TAS-PLP loadport incorporates SEMI Standard 450 table design with TDK’s standard loadport and utility interface to meet the high growth PLP packaging market. The TDK TAS PLP can handle panel sizes of 500mm ~650mm using Shin-etsu Poly panel FOUPs. Options include N2 purge, panel mapping and ethernet.

About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, and magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2018, TDK posted total sales of USD 12 billion and employed about 103,000 people worldwide.



Contact:

TDK Corporation of America
Ms. Sara M. Lambeth, +1-972-409-4519
Email Contact




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