MagnaChip Offers 2nd-Generation 0.13 Micron BCD Process Technology with High-Density Embedded Flash Memory

SEOUL, South Korea and SAN JOSE, Calif., Feb. 12, 2018 — (PRNewswire) — MagnaChip Semiconductor Corporation ("MagnaChip" or the "Company") (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory. This second-generation BCD process offers advanced features compared to previous BCD processes, which are high-density Flash memory up to 64 kilo bytes, low specific Ron of power LDMOS up to 40V, low number of photo steps and automotive grade reliability. These characteristics make the new generation of BCD process technology highly suitable for programmable PMICs, wireless power chargers, USB-C power-delivery IC products and automotive power ICs.

Traditionally, the non-volatile memories in the BCD process are low in density, below 256 bytes, for trimming purposes. However, today's electronic devices require more complex functions and lower power consumption. As a result, there is a greater market need for high-density embedded non-volatile memory in the BCD process. This memory includes Flash memory used for power ICs, including programmable PMICs, wireless power chargers and USB-C power-delivery ICs. In some applications, high-density Flash memory up to 64 kilo bytes is used to store programming codes as well as trimming data. Until now, the drawback of implementing high-density embedded memory in other BCD processes has been that it increases the overall number of manufacturing steps.

MagnaChip was able to eliminate 8 photo steps in the second-generation BCD process from the 1st generation by process optimization. Aside from embedded non-volatile memory, the 2nd generation also achieved the improvement of power LDMOS specific Ron performance, which is well suited for high-power requirements up to 40V operation. For IoT and automotive applications, this BCD process provides 1.5V and 5V CMOS devices with very low leakage current level that enables low power consumption. Furthermore, this new BCD process has various option devices for Hall sensors, varactors, inductors, and RF CMOS devices that are useful for highly integrated IC solutions, which give smaller system size and less system cost.

YJ Kim, Chief Executive Officer of MagnaChip, commented, "The integration of analog-based BCD and high density non-volatile memory enables highly suitable ICs and system designs for power management solutions, wireless chargers and power ICs used in smartphones, IoT devices and automotive applications." Mr. Kim added, "Our goal is to continue to develop specialized and innovative process technologies that meet the changing market requirements of our foundry customers."

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company's Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com

CONTACTS:


In the United States:

In Korea:

Bruce Entin

Chankeun Park

Entin Consulting

Director of Public Relations

Tel. +1-408-625-1262

Tel. +82-2-6903-3195

Investor.relations@magnachip.com

chankeun.park@magnachip.com

Cision View original content: http://www.prnewswire.com/news-releases/magnachip-offers-2nd-generation-013-micron-bcd-process-technology-with-high-density-embedded-flash-memory-300594949.html

SOURCE MagnaChip Semiconductor Corporation

Contact:
Company Name: MagnaChip Semiconductor Corporation
Web: http://www.magnachip.com
Financial data for MagnaChip Semiconductor Corporation




Review Article Be the first to review this article
Aldec

Downstream : Solutuions for Post processing PCB Designs

Featured Video
Jobs
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Upcoming Events
Methodics User Group Meeting at Maxim Integrated 160 Rio Robles San Jose CA - Jun 5 - 6, 2018
2018 FLEX Korea at Room 402/ 403, COEX Seoul Korea (South) - Jun 20 - 21, 2018
IEEE 5G World FOrum at 5101 Great America Parkway Santa Clara CA - Jul 9 - 11, 2018
PCB WEST 2018 Conference & Exhibition at Santa Clara Convention Center Santa Clara CA - Sep 11 - 13, 2018
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: UltraPLL
DAC2018



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise