Toshiba Memory Corporation Unveils Embedded NAND Flash Memory Products for Automotive Applications Compliant with UFS Ver. 2.1

- Addresses data storage demands of increasingly complex applications including automotive information & entertainment systems and ADAS -

TOKYO — (BUSINESS WIRE) — December 11, 2017Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun shipping samples of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS[1] version 2.1[2]. The new products meet AEC-Q100 Grade2[3] requirements and support a wide temperature range of -40°C to +105°C, offering the enhanced reliability capabilities that are required by increasingly complex automotive applications. The line-up meets a broad range of applications requirements with five different capacities: 16GB, 32GB, 64GB, 128GB and 256GB. [4]

This press release features multimedia. View the full release here: http://www.businesswire.com/news/home/20171211006358/en/

Toshiba Memory Corporation: Automotive UFS products (Photo: Business Wire)

Toshiba Memory Corporation: Automotive UFS products (Photo: Business Wire)

The new products are embedded NAND flash memory products that integrate NAND chips fabricated with 15nm process technology and a controller in a single package. Storage requirements for automotive applications continue to increase as systems including automotive information & entertainment systems and ADAS[5] become more sophisticated, and UFS supports their high performance and density needs. The addition of automotive UFS expands Toshiba Memory Corporation’s line-up of embedded NAND flash memory products for automotive applications, which currently includes automotive e-MMC[6] products. Utilizing the UFS interface allows the new products to achieve sequential read of 850MB/s and random read of 50kIOPs, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively.[7]

Other new functions specifically suited to automotive applications have been added to the new UFS products, including Refresh, Thermal Control and Extended Diagnosis. Refresh can be used to refresh data stored in the UFS and can contribute to the extension of the data’s life span. Thermal Control protects against overheating in the high temperatures that can occur in automotive applications. Extended Diagnosis helps users to understand the condition of the product.

Toshiba Memory Corporation’s UFS products have been used to boost overall system performance in mobile devices, and the introduction of automotive UFS products is expected to have a similarly positive impact on the development of automotive information & entertainment systems and ADAS. Toshiba Memory Corporation is already in discussion with major automobile makers on the possibility of implementing the new line-up in next-generation projects. As the storage requirements for automotive applications continue to grow, Toshiba Memory Corporation will continue to lead the market by reinforcing its lineup of high-performance, high-density memory solutions targeting the sector.

Outline of the New Products

 
Interface   JEDEC UFS V2.1 standard

HS-G3 interface

Capacity 16GB, 32GB, 64GB, 128GB, 256GB
Power Supply Voltage

2.7-3.6V (Memory core)
1.7V-1.95V (Interface)

Temperature Range   -40oC to +105oC
 
Product Name   Capacity   Package   Sample Date
THGAF9G7L1LBAB7 16GB 153Ball FBGA   11.5x13.0x1.0mm Dec. 2017
THGAF9G8L2LBAB7 32GB 153Ball FBGA 11.5x13.0x1.0mm Dec. 2017
THGAF9G9L4LBAB8 64GB 153Ball FBGA 11.5x13.0x1.2mm Dec. 2017
THGAF9T0L8LBAB8 128GB 153Ball FBGA 11.5x13.0x1.2mm Dec. 2017
THGAF9T1LBLBABY   256GB   169Ball FBGA   12.0x16.0x1.6mm   2Q, 2018 (Apr. - Jun.)
 

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