3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

Proceeds to Benefit IMAPS Foundation and Phoenix Children’s Hospital

Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration technologies. Historically held during SEMICON West, the 2018 edition of the 3D InCites Awards reflects changes in venue, award categories, and benefit charities.

“The IMAPS Device Packaging Conference is known worldwide as the leading forum in which to exchange knowledge with industry peers regarding the advancement of heterogeneous integration technologies. Due to the synergies between the IMAPS membership and 3D InCites audience, we felt it was the optimal venue for holding our sixth annual 3D InCites Awards,” said Françoise von Trapp, Queen of 3D, 3D InCites. “We are excited about this collaboration, and we thank the IMAPS committee for hosting this year’s event.”

In 3D InCites’ ongoing commitment to STEM education and finding kid-size cures for childhood cancer, proceeds from this year’s event will benefit two charities: the IMAPS Microelectronics Foundation, which exists to support student activities related to the study of microelectronic packaging, interconnect, and assembly; and Phoenix Children’s Hospital pediatric oncology programs, the only institution in Arizona conducting Phase I trials, giving pediatric cancer patients access to the latest and most advanced treatments. Sponsorship opportunities for 2018 3D InCites Awards are now available.

“IMAPS is proud to expand our growing partnership with 3D InCites for this worthy awards program,” said Michael O'Donoghue, Executive Director, IMAPS.  “The 2018 3D InCites Awards are a welcome addition to the Device Packaging Conference program, and will present a positive opportunity to the industry award beneficiaries and the two fundraising recipient foundations. The society looks forward to the debut of this impactful collaboration.”

Established in 2013 to acknowledge excellence in 3D integration technologies, the 3D InCites Awards program has evolved over the years to be a most coveted prize that recognizes technologies, individuals, and companies that have made significant contributions to the advancement of the heterogeneous integration roadmap. Winners are chosen by industry peers through an online voting process.

Online nominations will be accepted from January 8 to February 12, 2018. Voting is open February 14-28, 2018. Winners will be announced Wednesday, March 7, during an awards ceremony and cocktail reception at the 2018 IMAPS Device Packaging Conference at We-Ko-Pa Resort in Fountain Hills, Arizona.

The 2018 3D InCites Awards will be presented in the following categories:

•                Device of the Year

•                Process of the Year

•                Manufacturer of the Year (fabless, fab, OSAT)

•                Startup of the Year

•                Equipment Supplier of the Year

•                Materials Supplier of the Year

•                EDA Provider of the Year

•                Research Institute of the Year

•                Engineer of the Year


Full details about the 2018 3D InCites Awards are available here.

About 3D InCites

The premier content platform for heterogeneous integration technologies, 3D InCites brings to life the people, personalities, and the minds behind heterogeneous integration in a uniquely personal way. The goal is to inform key decision-makers about trends, applications, progress in technology development, design, standards, infrastructure, and implementation.

About IMAPS International

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses, and other efforts. IMAPS currently has more than 3,000 members in the United States and international members around the world.

Media Contacts
Françoise von Trapp

3D InCites

978-340-0773

Email Contact

 

 

Brianne Lamm

IMAPS International

980-299-9873

Email Contact



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