Suite of silicon-proven PHYs on 14nm LPP process technology maximize performance and flexibility
SUNNYVALE, Calif. — (BUSINESS WIRE) — October 12, 2017 — Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very short reach) PHYs developed for GLOBALFOUNDRIES high-performance FX-14™ ASIC platform. Built on the GLOBALFOUNDRIES’ 14nm FinFET (14LPP) process technology, the Rambus SerDes PHYs are optimized for power and area at peak bandwidth, generating Ethernet speeds up to 100Gb and beyond for high-speed wireline, wireless, 5G network infrastructure, high-performance servers, storage, connectivity and compute applications.
“Data traffic and bandwidth demands have exploded, driving the insatiable need for highly optimized, high-performance semiconductor solutions,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division. “Through our collaboration with GLOBALFOUNDRIES, Rambus is delivering robust high-speed interface IP that enables innovative chips and systems designed specifically for the Data Center and Communications markets and helping GLOBALFOUNDRIES deliver value to its customers through tested solutions.”
“Next-generation systems for cloud and communications must deliver more performance and handle more complexity than ever before,” said Kevin O’Buckley, vice president of product development at GLOBALFOUNDRIES. “Working together with Rambus enables us to provide ASIC solutions to our customers with a range of high-speed SerDes interfaces that have been optimized for power and area at peak bandwidth while maintaining complete compatibility with industry standards.”
The Rambus SerDes PHYs include a Physical Media Attachment (PMA) hard macro and Physical Coding Sub-layer with Built-in Self-Test (PCS-BIST) soft macro. The PHYs can also be configured to multiple channel widths and packaging options, which simplifies integration and maximizes design flexibility.
For additional information on Rambus SerDes Interface Solutions, please visit rambus.com/serdes.
About Rambus Memory and Interfaces Division
The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.
About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit rambus.com.
Source: Rambus Inc.
Leslie Clavin, 415-591-8440