To speak with Herb Reiter about the rationale for multi-die packaging is a chance to follow a logical and energetic continuum from first principles to a final conclusion. Namely, that as the era of the ASIC subsides, the era of the multi-die package will arrive full force.
Reiter, President of eda 2 asic, will be reiterating this line of thinking, in conjunction with a panel of like-minded experts, at the upcoming EDPS conference in Monterey on April 21st. In anticipation of that session – “Multi-Die IC Design and Application” – we spoke by phone this week. The conversation was compelling.
