Posts Tagged ‘IEDM’
Thursday, July 28th, 2016
A number of conferences important to EDA and IP are coming up over the next 12 months and currently looking for content. If you have an industry-relevant topic you’d like to talk about, the organizers of some of these conferences need to hear from you soon. Various deadlines are looming, most over the next few weeks.
Meanwhile, it’s interesting to consider that one of the most thrill- for-your-buck conferences on the list is Black Hat USA 2016 and Synopsys’ co-located CodenomiCON, both promising to teach you everything you need to know or are allowed to know about cybersecurity. Synopsys’ involvement in Black Hat may validate a comment overheard recently: ‘Synopsys is no longer really an EDA company. They’ve become a software integrity company.’
Also interesting, DVCon in San Jose and Mobile World in Barcelona in 2017 are on the exact same days. Perhaps there’s no overlap in the attendee population. But most interesting on the list, the sheer scale of the China International Modern Industry & Intelligent Equipment Exhibition with 500+ exhibitors, over 40,000 attendees, and more topics that you can possibly imagine.
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Tags: 3D ASIP, 3DExperience Forum, ARC Processor Summit, AWR Design Forum, Black Hat USA, DATE, Design Automation Conference, DVCon U.S., Embedded Systems Conference, European Innovation Day, Flash Memory Summit, Hot Chips, ICCAD, IEDM, IEEE Semiconductor Interface Specialists Conference, IEEE SFBA Nanotechnology Council, ISSCC, MIPI DevCon, Mobile World Congress
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Thursday, September 5th, 2013
Okay, summer’s over, September has arrived, and it’s time to figure out where you’re going to go over the next few months, conference wise. Some events are imminent, but others are a ways out, giving you time to think about registering and attending. Some events are vendor neutral, while others are vendor specific, which doesn’t preclude a chance to learn stuff. Although this list is lengthy, it isn’t comprehensive.
* ITC 2013
International Test Conference
Anaheim – September 8-12
* IDF 2013
Intel Developers Forum
San Francisco – September 10-12
* SNUG Taiwan
Hsinchu – September 10-11
* CDNLive China 2013
Beijing – September 10
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Tags: ARM TechCon, CDNLive, Electronic Systems for Motor Vehicles, Embedded Linux Conference Eruope, Embedded Vision Summit, ICCAD, IDF, IEDM, IESF Automotive, ITC, Jasper User Group Meeting, Linley Processor Conference, PCB West, SAME Forum, SNUG, SOC Conference
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Thursday, December 13th, 2012
When it comes to stimulating, it doesn’t get better than stepping out of a session at IEDM in San Francisco to take a conference call from Glasgow. On Tuesday, December 11th, I stepped out of Session 9 and a presentation on spintronics to speak with Dr. Asen Asenov about a different device technology.
Asenov is a 20-year veteran of the University of Glasgow, where he serves as James Watt Professor of Electrical Engineering and heads up the Glasgow Device Modeling Group. He is also founder of Glasgow-based Gold Standard Simulations (GSS), a company that specializes in simulating statistical variability in nano-CMOS devices.
We spoke on December 11th because GSS announced that day the results of research “comparing the differentiation between metal gate first and metal gate last FDSOI [fully-depleted silicon-on-insulation] approaches, and comparing it to equivalent bulk MOSFETs.” Based on that work, the company announced that gate-last technology “offers significant advantages” over gate-first technology for devices built on 32- or 28-nanometer FDSOI, and noted that both nodes “significantly outpace equivalent bulk MOSFETS with respect to low-power SRAM design.”
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Tags: Asen Asenov, bulk CMOS, FDSOI, FinFETs, GlobalFoundries, GSS, IEDM, Intel, STMicro, University of Glasgow
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Thursday, November 29th, 2012
You’ve got a little over a week to clear your calendar to attend two very important conferences spanning the week of December 10th to the 14th. IEDM is happening in San Francisco from December 10th to 12th, and the 3-D Architectures for Semiconductor Integration and Packaging Conference is happening in Redwood City from December 12th to 14th.
These are two well-attended and carefully constructed conferences which many people attend to learn about the latest in device engineering and 3D-IC architectures, both key to the future of the semiconductor industry.
Clearly, December is a busy month. If you’re in Sales, you may be trying to maximize your numbers for the quarter, and the year, over the remaining weeks of 2012. If you’re in R&D, you may be trying to utilize budget dollars that come with ‘use it or lose it’ strings attached. If you’re in Field Support, your customers are stressed, short on time, and need your attention sooner, not later, so they can wrap up their projects before their holiday leave begins. And if you’re that customer, the Designer trying to meet a development schedule, you are really strapped for time.
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Tags: 3-D Architectures for Semiconductor Integration and Packaging, IEDM
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Wednesday, August 29th, 2012
As Labor Day Weekend comes to a close, summer is officially over. Now it’s time to look out across the next 4 months and figure out how you’re going to spend your conference travel budget. Here’s just a small sampling of the many excellent options available to you.
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* IMAPS: International Symposium on Microelectronics
September 9-13
San Diego Convention Center
* CICC: Custom Integrated Circuits Conference
September 9-12
Double Tree Hotel, San Jose
* HPEC: High Performance Extreme Computing Conference
September 10-12
Westin Hotel, Waltham
* IDC: Intel Developers Conference
September 11-13
Moscone Center, San Francisco
* Design East: The Center of the Engineering Universe
September 17-20
Hynes Center, Boston
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Tags: CICC, CPCW, Design East, EDAC, EVS, HPEC, ICCAD, IDC, IEDM, IMAPS, ISoCC, ITC, IWLPC, PCB West, SAME
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