You need no more evidence than the just-published agenda for June’s Design Automation Conference in Austin to prove that the EDA industry is now a complex amalgamation of technologies, applications and markets. Not to mention people.
This year’s keynotes and skywalks cover a range of topics: From how the IoT will make smart buildings smarter, to why hardware/software co-design is being relabeled as digital twin[ning], why III-V compound semiconductors are the wave of the future, how wearable devices will soon be able to snoop around and find out if you’re having a bad day, and – did we mention the IoT?
New this year, even politics will get its 25 minutes of fame with a keynote outlining what’s up with ICs in China.
In other words, at DAC 2017 the topics are all over the map. You no longer just hear about the nuts and nuances of design; now you hear as much about what’s going on downstream in the system that runs on the IC as you hear about designing the IC itself.
There is a deeper meaning in all of this, of course.
