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SmartDV – Electronic Design Industry Predictions

 
January 13th, 2021 by Industry Experts

Bipul Talukdar Director of Applications Engineering, North America, SmartDV

The chip design weathered 2020 pretty well and, from all accounts, is on track to do even better in 2021.

2020 taught us how to work more efficiently and productively, important skills as we move into 2021. Design activity is ongoing and robust even as the industry dynamics shifted to a work-from-home model. Working from home, in many cases, means less distractions and more dedicated hours on a project. Remote meetings and virtual events are commonplace and the industry adapted, though it’s been a difficult adjustment for designers who are better at using a whiteboard than words to describe their work.

As we move through 2021, I predict the raging complexity of SoCs and new applications will make chip design verification even more important. Now clocked in at 60% to 80% of a project development cycle, verification may, in fact, consume a larger chunk of a time. The risk of a failed design is too great and the need for a respin on a complex chip manufactured in an advanced process node can be expensive or worse, ruinous for a company with limited resources.

Of course, no 2021 prediction would be complete without mention of RISC-V, the open-source solution for developing a CPU or custom accelerator. Verification engineers can expect various announcements about commercial verification flows to support RISC-V development projects.

About Bipul Talukdar

Bipul Talukdar is SmartDV’s director of Applications Engineering in North America. He is an expert in hardware functional verification with a specialty in Verification IP development, formal property verification and hardware emulation. Talukdar’s recent experience is in formal verification of RISC-V based cores and subsystems and coverage-based closure. He holds a Bachelor of Science degree in Engineering, Electronics and Telecommunication from the National Institute of Technology, Silchar in India.

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