EDACafe Editorial Peggy Aycinena
Peggy Aycinena is a contributing editor for EDACafe.Com Conferences: Paper submission deadlines approachJuly 28th, 2016 by Peggy Aycinena
Meanwhile, it’s interesting to consider that one of the most thrill- for-your-buck conferences on the list is Black Hat USA 2016 and Synopsys’ co-located CodenomiCON, both promising to teach you everything you need to know or are allowed to know about cybersecurity. Synopsys’ involvement in Black Hat may validate a comment overheard recently: ‘Synopsys is no longer really an EDA company. They’ve become a software integrity company.’ Also interesting, DVCon in San Jose and Mobile World in Barcelona in 2017 are on the exact same days. Perhaps there’s no overlap in the attendee population. But most interesting on the list, the sheer scale of the China International Modern Industry & Intelligent Equipment Exhibition with 500+ exhibitors, over 40,000 attendees, and more topics that you can possibly imagine.
**************** * Black Hat USA 2016 – 30 July to 4 August 2016 – Las Vegas * Flash Memory Summit – 9-11 August 2016 – Santa Clara * IEEE SFBA Nanotechnology Council – 16 August 2016 – Santa Clara * Hot Chips – 21-23 August 2016 – Cupertino * 2016 AWR Design Forum – August thru October – Asia, Europe, North America * Embedded Systems Conference – September, October, December – Minneapolis, Bangalore, San Jose * European Innovation Day – 12 September 2016 – Silicon Valley * ARC Processor Summit – 13 September 2016 – Santa Clara * MIPI DevCon – 14-15 September 2016 – Mountain View * 3DExperience Forum Eurocentral 2016 – 25-26 October 2016 – Berlin * SEMICON Europa 2016 – 25-27 October 2016 – Grenoble * ARM TechCon 2016 – 25-27 October 2016 – Santa Clara * 2016 ICCAD – 7-10 November 2016 – Austin * 2016 IEEE IEDM – 3-7 December 2016 – San Francisco * IEEE Semiconductor Interface Specialists Conf – 7-10 December 2016 – San Diego * 3D ASIP – 13-15 December 2016 – San Francisco * DesignCon 2017 – 31 January to 2 February 2017 – Santa Clara * IEEE ISSCC 2017 – 5-9 February 2017 – San Francisco * DVCon U.S. 2017 – 27 February to 2 March, 2017 – San Jose * Mobile World Congress – 27 February to 2 March 2017 – Barcelona * ISQED – March 2017 – Santa Clara * DATE 2017 – 27-31 March 2017 – Lussaune * 54th Design Automation Conference – 18-22 June 2017 – Austin * 14th China International Modern Industry & Intelligent Equip Exhibition – 24-26 June 2017 – Shanghai
RelatedTags: 3D ASIP, 3DExperience Forum, ARC Processor Summit, AWR Design Forum, Black Hat USA, DATE, Design Automation Conference, DVCon U.S., Embedded Systems Conference, European Innovation Day, Flash Memory Summit, Hot Chips, ICCAD, IEDM, IEEE Semiconductor Interface Specialists Conference, IEEE SFBA Nanotechnology Council, ISSCC, MIPI DevCon, Mobile World Congress This entry was posted on Thursday, July 28th, 2016 at 8:09 pm. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site. |