Kevin Steptoe is VP of Engineering at Sondrel, a global chip-design consultancy based in Reading, U.K. We spoke this morning by phone about the future of FinFETs, in particular Steptoe’s reaction to my blog posted earlier this month, FinFETs: Yes, No, Maybe.
Steptoe said there’s nothing maybe about FinFETs. They are most definitely “an absolute yes” – revolutionary and disruptive as they may be – and offer great promise for the future of chip design, manufacturing, and deployment. And he said, his enthusiasm for the technology is not just from Sondrel’s point of view, but from his own personal involvement in the industry that extends back several decades.
Per Steptoe: “As the world’s increasingly insatiable demand for mobile, tablet-based, higher frequency devices ramps up, the predominant challenges for engineers and designers translate into fears of leakage power and performance. The FinFET, in its construction, addresses these challenges and makes mobile devices dramatically more possible.
“[In fact], the control of the short-channel affect and suppression of leakage actually simplifies things, so engineers will have the opportunity to achieve much higher [transistor] density, much lower power, and similar-or-increased performance levels. We see FinFETs as a win all the way around, a no-brainer that will fully live up to what it says on the tin: With FinFETS you will design ever larger devices with an ever higher power profile.”