December 10th to 14th: IEDM & 3-D Architectures

You’ve got a little over a week to clear your calendar to attend two very important conferences spanning the week of December 10th to the 14th. IEDM is happening in San Francisco from December 10th to 12th, and the 3-D Architectures for Semiconductor Integration and Packaging Conference is happening in Redwood City from December 12th to 14th.

These are two well-attended and carefully constructed conferences which many people attend to learn about the latest in device engineering and 3D-IC architectures, both key to the future of the semiconductor industry.

Clearly, December is a busy month. If you’re in Sales, you may be trying to maximize your numbers for the quarter, and the year, over the remaining weeks of 2012. If you’re in R&D, you may be trying to utilize budget dollars that come with ‘use it or lose it’ strings attached. If you’re in Field Support, your customers are stressed, short on time, and need your attention sooner, not later, so they can wrap up their projects before their holiday leave begins. And if you’re that customer, the Designer trying to meet a development schedule, you are really strapped for time.

All of this means there’s little time left to head off to IEDM or the 3-D Architectures Conference, but that might be a mistake. Whether you’re in Sales, R&D, Field Support, or a Designer, you need to look to the long term while also paying attention to your short-term agenda. Not easy at all, but perhaps attending these conferences during the week of December 10th to 14th should be seen as an investment in your own future as much as it is in the future of the industry.

IEDM …

“With a history stretching back nearly 60 years, the IEEE International Electron Devices Meeting (IEDM) is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling.

“IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.  The conference scope not only encompasses devices in silicon, compound and organic semiconductors, but also in emerging material systems.  IEDM is truly an international conference, with strong representation from speakers from around the globe.”

3-D Architectures …

“The 9th international conference, 3-D Architectures for Semiconductor Integration and Packaging, brings together technology and business leaders from around the world to take a look at the technology and market landscape for emerging 3-D device and systems integration and interconnect.

“Today, questions around 3-D solutions increasingly focus on when, not if, the industry will see product introduction and high volume manufacturing. Products based on 3-D chip scale packaging have already made significant inroads, in particular for image sensors, and 2.5-D devices with interposers, e.g. in FPGAs, are also seeing market introduction, and very healthy market growth for such uses is widely anticipated.”

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Tags: 3-D Architectures for Semiconductor Integration and Packaging, IEDM

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