Dr. Jaakko Juntunen, Head of EM Applications for AWR Europe present on the optimization of parameterized EM shapes in the AXIEM 2011 3D planar analysis design tool.

John Fiela from CapeSym presents integration of SYMMIC thermal simulation software with Microwave Office from AWR.   AWR’s Microwave Office high-frequency design platform and CapeSym’s easy-to-use SYMMIC templates produce unique and unparalleled electrical-thermal MMIC co-design of high-power RF components.

IBM has a long history of innovation in the field on electronic design automation (EDA), beginning in the 1950’s when IBM started mass-producing computers. Engineers saw the need to control and streamline production and began using early computers such as the IBM 704 to document designs and to check the correctness of the Boolean equations specifying the behavior. In the decades that followed, IBM continued facing new challenges and solving them with pioneering inventions including circuit simulation, static timing analysis, Boolean comparison, cycle simulation, hardware acceleration, logic and physical synthesis, large scale physical design, layout checking and automated testing in manufacturing.

This video, Inside IBM EDA: 50 Years of Innovation, describes some of the innovations developed at IBM through a series of interviews with a few of the original pioneers. A small team of volunteers from IBM’s EDA community created this video for an internal workshop. They are now making it available for a larger audience.

This video presentation covers the integration of AWR’s Visual System Simulator with National Instrument’s Labview and is presented by Gent Paparisto.

Gent Paparisto, Ph.D., is a Senior Systems Engineer at AWR. He received his Ph.D. in electrical engineering from the University of Southern California (USC) and has extensive experience in research, design, development, and implementation of communication systems and algorithms for wireless, satellite, and wireline applications. He has lead and participated in the design and implementation of several products for cellular and wireless systems. Dr. Paparisto has authored a number of publications in international journals and conferences, served on the technical program committees of various IEEE conferences and contributed to the 3GPP GERAN standardization group.

The worldwide need for smart, energy-efficient electronics has never been greater while engineering challenges continually expand. Solutions to these engineering challenges rely on accurate, predictive simulation software.  The acquisition of Apache complements ANSYS’ software solutions by bringing together best-in-class products that drive ANSYS’ system vision for integrated circuits, electronic packages and printed circuit boards.

Aveek Sarkar from Apache and Larry Williams of ANSYS discuss product roadmaps and integration from both companies.