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Sanjay Gangal
Sanjay Gangal
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Intel Foundry Expands Defense Partnerships with New RAMP-C Customers

 
January 20th, 2025 by Sanjay Gangal

Intel Foundry, a cornerstone of U.S. semiconductor manufacturing, has further strengthened its commitment to national security and technological leadership. The company announced the onboarding of Trusted Semiconductor Solutions and Reliable MicroSystems as part of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) project. This addition marks a critical milestone in the Department of Defense’s Trusted & Assured Microelectronics (T&AM) program, signaling progress in securing a robust, domestic semiconductor supply chain.

Intel 18A wafer – Credit: Intel Corporation

RAMP-C, initiated in 2021 and now in its third phase, is a vital component of the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) initiative. It allows defense industrial base (DIB) partners to leverage Intel’s most advanced process technologies for prototyping and high-volume manufacturing of microelectronics devices that meet both commercial and defense needs.

Expanding Partnerships for National Security

The inclusion of Trusted Semiconductor Solutions and Reliable MicroSystems underscores the program’s rapid growth and Intel Foundry’s pivotal role. Kapil Wadhera, vice president of Intel Foundry and general manager of its Aerospace, Defense, and Government Business Group, commented on the expansion:

“We are very excited to welcome Trusted Semiconductor Solutions and Reliable MicroSystems to the RAMP-C project we are engaged in with the DoD. The collaboration will drive cutting-edge, secure semiconductor solutions essential for our nation’s security, economic growth and technological leadership. We are proud of the pivotal role Intel Foundry plays in supporting U.S. national defense and look forward to working closely with our newest DIB customers to enable their innovations with our leading-edge Intel 18A technology.”

These partnerships align with Intel Foundry’s broader strategy to ensure U.S. leadership in semiconductor manufacturing, enhancing both economic competitiveness and national security. The company remains the sole U.S.-based manufacturer of leading-edge semiconductor technology.

Pioneering Innovation with Intel 18A Technology

At the heart of Intel Foundry’s contributions to RAMP-C is its Intel 18A process node, representing a leap forward in transistor technology. Combining PowerVia backside power delivery and RibbonFET gate-all-around transistors, Intel 18A delivers unparalleled improvements in power efficiency, density, and performance-per-watt—critical attributes for defense applications that demand stringent size, weight, and power optimization.

Intel’s advanced packaging technologies further enhance these capabilities. The embedded multi-die interconnect bridge (EMIB) enables high-density interconnects for heterogeneous chip architectures, essential for modern computing demands. By integrating these cutting-edge technologies, Intel provides a complete ecosystem for designing, prototyping, and manufacturing advanced microelectronics.

Phase-by-Phase Progress of RAMP-C

Since its launch, RAMP-C has evolved through three distinct phases, each marking significant progress toward strengthening U.S. semiconductor resilience:

  1. Foundation Building (Phase 1, 2021):
    Intel led the development of intellectual property (IP), established a robust ecosystem, and laid the groundwork for early test chip designs. This phase focused on creating the infrastructure necessary to support advanced semiconductor innovation.
  2. Expansion and Onboarding (Phase 2, 2023):
    During this phase, Intel expanded its customer base, welcoming major DIB partners such as Boeing and Northrop Grumman. These collaborations demonstrated the applicability of Intel 18A for both defense and commercial applications, while ramping up ecosystem solutions.
  3. Advanced Prototyping and Manufacturing (Phase 3, 2024-2025):
    Intel initiated the tape-out and testing of early DIB product prototypes, signaling the readiness of Intel 18A for high-volume manufacturing. Trusted Semiconductor Solutions and Reliable MicroSystems have now joined this phase, gaining access to Intel’s advanced technologies to develop and prototype critical solutions.

Strategic Implications for U.S. Defense and Beyond

Dr. Catherine Cotell, T&AM program manager at the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)), emphasized the strategic importance of the RAMP-C initiative:

“RAMP-C continues to promote development of leading-edge microelectronics for both DoD and commercial applications and supports advanced semiconductor design and manufacturing in the U.S. to strengthen national security,”

Intel’s contributions to RAMP-C go beyond manufacturing. The company’s ecosystem approach integrates IP providers, electronic design automation (EDA) tools, and design services, creating a seamless pipeline for innovation. By providing access to advanced technologies early in the design process, Intel ensures that DIB customers can meet the growing demands of national defense.

Intel’s Role in Rebalancing the Global Supply Chain

The RAMP-C project is not just about securing defense capabilities; it is part of a broader effort to rebalance the global semiconductor supply chain. With geopolitical uncertainties and growing demand for secure microelectronics, the U.S. aims to reduce dependence on foreign manufacturing. Intel Foundry’s role in this initiative demonstrates its leadership in building a resilient, sustainable, and secure supply chain.

The Road Ahead

As Intel Foundry continues to advance the RAMP-C project, the impact on U.S. defense and technology sectors will be profound. The integration of cutting-edge technologies like Intel 18A and EMIB into defense systems sets a new benchmark for performance and security. Trusted Semiconductor Solutions and Reliable MicroSystems now join a growing network of partners poised to redefine the landscape of secure microelectronics.

With these advancements, Intel is not only shaping the future of semiconductor manufacturing but also reinforcing its commitment to national security, economic growth, and global technological leadership. This latest development cements Intel’s position as an indispensable partner in the U.S. government’s mission to innovate and secure the nation’s technological future.

Credit: Intel Corporation for the accompanying photo of the Intel 18A wafer.

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Category: Intel

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