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Video Roundup ![]() Sanjay Gangal
A showcase for electronic design videos around the world-wide web. Intel Foundry Expands Defense Partnerships with New RAMP-C CustomersJanuary 20th, 2025 by Sanjay Gangal
Intel Foundry, a cornerstone of U.S. semiconductor manufacturing, has further strengthened its commitment to national security and technological leadership. The company announced the onboarding of Trusted Semiconductor Solutions and Reliable MicroSystems as part of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) project. This addition marks a critical milestone in the Department of Defense’s Trusted & Assured Microelectronics (T&AM) program, signaling progress in securing a robust, domestic semiconductor supply chain. RAMP-C, initiated in 2021 and now in its third phase, is a vital component of the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) initiative. It allows defense industrial base (DIB) partners to leverage Intel’s most advanced process technologies for prototyping and high-volume manufacturing of microelectronics devices that meet both commercial and defense needs.
Expanding Partnerships for National SecurityThe inclusion of Trusted Semiconductor Solutions and Reliable MicroSystems underscores the program’s rapid growth and Intel Foundry’s pivotal role. Kapil Wadhera, vice president of Intel Foundry and general manager of its Aerospace, Defense, and Government Business Group, commented on the expansion:
These partnerships align with Intel Foundry’s broader strategy to ensure U.S. leadership in semiconductor manufacturing, enhancing both economic competitiveness and national security. The company remains the sole U.S.-based manufacturer of leading-edge semiconductor technology. Pioneering Innovation with Intel 18A TechnologyAt the heart of Intel Foundry’s contributions to RAMP-C is its Intel 18A process node, representing a leap forward in transistor technology. Combining PowerVia backside power delivery and RibbonFET gate-all-around transistors, Intel 18A delivers unparalleled improvements in power efficiency, density, and performance-per-watt—critical attributes for defense applications that demand stringent size, weight, and power optimization. Intel’s advanced packaging technologies further enhance these capabilities. The embedded multi-die interconnect bridge (EMIB) enables high-density interconnects for heterogeneous chip architectures, essential for modern computing demands. By integrating these cutting-edge technologies, Intel provides a complete ecosystem for designing, prototyping, and manufacturing advanced microelectronics. Phase-by-Phase Progress of RAMP-CSince its launch, RAMP-C has evolved through three distinct phases, each marking significant progress toward strengthening U.S. semiconductor resilience:
Strategic Implications for U.S. Defense and BeyondDr. Catherine Cotell, T&AM program manager at the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)), emphasized the strategic importance of the RAMP-C initiative:
Intel’s contributions to RAMP-C go beyond manufacturing. The company’s ecosystem approach integrates IP providers, electronic design automation (EDA) tools, and design services, creating a seamless pipeline for innovation. By providing access to advanced technologies early in the design process, Intel ensures that DIB customers can meet the growing demands of national defense. Intel’s Role in Rebalancing the Global Supply ChainThe RAMP-C project is not just about securing defense capabilities; it is part of a broader effort to rebalance the global semiconductor supply chain. With geopolitical uncertainties and growing demand for secure microelectronics, the U.S. aims to reduce dependence on foreign manufacturing. Intel Foundry’s role in this initiative demonstrates its leadership in building a resilient, sustainable, and secure supply chain. The Road AheadAs Intel Foundry continues to advance the RAMP-C project, the impact on U.S. defense and technology sectors will be profound. The integration of cutting-edge technologies like Intel 18A and EMIB into defense systems sets a new benchmark for performance and security. Trusted Semiconductor Solutions and Reliable MicroSystems now join a growing network of partners poised to redefine the landscape of secure microelectronics. With these advancements, Intel is not only shaping the future of semiconductor manufacturing but also reinforcing its commitment to national security, economic growth, and global technological leadership. This latest development cements Intel’s position as an indispensable partner in the U.S. government’s mission to innovate and secure the nation’s technological future. Credit: Intel Corporation for the accompanying photo of the Intel 18A wafer. Tags: advanced packaging technologies, Intel 18A process technology, Intel Foundry, national security microelectronics, RAMP-C project, Trusted Semiconductor Solutions Category: Intel |