In a transformative leap for electronic systems design, Siemens Digital Industries Software has unveiled a next-generation platform that integrates its industry-leading tools—Xpedition™, Hyperlynx™, and PADS™ Professional. This groundbreaking release is more than a mere product update; it represents a holistic reimagining of the design process, aimed at solving critical challenges in a rapidly evolving industry.
I had the privilege of speaking with AJ Incorvaia, Senior Vice President of Electronic Board Systems at Siemens, who shared the philosophy and features driving this ambitious project. According to AJ, “This is the platform that we will be building on for years to come, combining the power of AI, seamless cloud connectivity, and a unified user experience to empower engineers and organizations.”
The electronics industry faces multiple hurdles: a wave of experienced engineers retiring, less experienced talent stepping in, growing design complexity, and supply chain instability. These factors demand tools that are intuitive yet powerful, fostering collaboration across increasingly globalized and multidisciplinary teams. To address these challenges, Siemens has unified its PCB design tools into a single cohesive platform. The new system not only integrates layout, schematic capture, and signal integrity analysis but also connects seamlessly with Siemens’ Teamcenter® for product lifecycle management and NX™ for mechanical engineering. This cross-domain collaboration ensures that electrical and mechanical engineers can work in harmony, solving a historically difficult problem of mismatched terminology and disconnected workflows.
