By David Kuo, AVP, Product Marketing & Business Development, Point2 Technology
Semiconductor Engineering 2025 predictions
The demand for ‘all things AI’ is putting pressure on every link in the value chain – especially datacenters which need to address the soaring bandwidth requirements created by generative AI and ML while containing costs, expanding performance, and improving energy efficiency. It’s a tall order, but in 2025 we’re going to see a shift.
As the AI/ML workload evolves—pushing the limits on data rates with trillions of calculations processed every second—it has become vital that cabling interconnects keep pace to support the growth. This requires an evolutional shift from the copper and optical technologies we’ve historically used to innovative approaches like e-Tube, a revolutionary interconnect using plastic for terabit data transmission.
