Industry Predictions 
Sanjay Gangal
Sanjay Gangal is a veteran of Electronics Design industry with over 25 years experience. He has previously worked at Mentor Graphics, Meta Software and Sun Microsystems. He has been contributing to EDACafe since 1999. EDACafe Industry Predictions for 2025 – Point2 TechnologyDecember 20th, 2024 by Sanjay Gangal
By David Kuo, AVP, Product Marketing & Business Development, Point2 Technology  Semiconductor Engineering 2025 predictions The demand for ‘all things AI’ is putting pressure on every link in the value chain – especially datacenters which need to address the soaring bandwidth requirements created by generative AI and ML while containing costs, expanding performance, and improving energy efficiency. It’s a tall order, but in 2025 we’re going to see a shift. As the AI/ML workload evolves—pushing the limits on data rates with trillions of calculations processed every second—it has become vital that cabling interconnects keep pace to support the growth. This requires an evolutional shift from the copper and optical technologies we’ve historically used to innovative approaches like e-Tube, a revolutionary interconnect using plastic for terabit data transmission.
e-Tube as an interconnect technology uses mmWave RF signal to transmit and receive data over a plastic dielectric waveguide. e-Tube is capable of terabit level throughput without the expensive and power-hungry optical components and complicated DSP of optical cabling while exceeding copper cable length by 10X at similar cost structures. It is ideal for accelerator-to-accelerator compute fabric, top-of-rack (ToR) to Smart NIC, ToR to ToR, and Distributed Disaggregated Chassis (DDC) connectivity in the data center. e-Tube will scale to multi-terabit speeds and provides the bandwidth density to scale up AI clusters for many generations. 2025 is going to be a big year for the market to recognize the value and begin to implement new interconnects in data center environments. These new interconnect solutions need to scale at the pace of AI accelerators while achieving best-in-class energy efficiency and affordability required for mass deployment for the next-generation AI/ML datacenters. I know our company intends to lead the charge. About Author: Tags: AI datacenters, e-Tube interconnect, energy efficiency., Generative AI, mmWave RF signal, terabit throughput Category: Predictions |
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