By Sanjeev Aggarwal, Ph.D., President and CEO, Everspin
Sanjeev Aggarwal
- Technological Innovations: “What major technological advancements or innovations do you foresee occurring in your industry in 2024, and how do you plan to adapt or lead in these areas?”
- Market Trends: “How do you predict consumer behavior and market trends will evolve in 2024, and what strategies are you implementing to meet these changing demands?”
- Artificial Intelligence Integration: “How do you envision the role and impact of artificial intelligence in your industry in 2024, and what steps is your company taking to integrate AI into its operations or offerings?”
There has never been a more exciting time to be in the semiconductor memory business. Innovation is required more than ever as it becomes clear that advances in computing at all levels are limited by memory performance. At the extreme performance boundary of AI acceleration for high-performance computing there will be broader adoption of high-bandwidth memory structures that provide wider I/O data busses to increase throughput and provide data to the multiple cores starving for data. Bus width of 1,024 with up to 9GT/s will give way to 2,048, bringing challenges to high-density memory providers to reduce micro-bump pitch and increase the density of TSVs to maintain the footprint in 3D SiP modules. This tends to drive the news in the memory industry, several other trends drive innovation as well.
