EDACafe Industry Predictions for 2024 – ARM

Here are two predictions by Gary Campbell, EVP Central Engineering and Richard Grisenthwaite, EVP Chief Architect, Arm

The future of AI

By Gary Campbell, EVP Central Engineering, Arm

“AI is fundamentally changing the way we live and work, and this transformation will only accelerate over the next 12 months – and well beyond that. In 2024, the conversation around AI will become more nuanced, focused on the different types of AI, use cases and – crucially – what technological foundation we need to put in place to make the AI-powered world of the future a reality.

Advanced, purpose-built chips will play a critical role in allowing today’s AI technologies to scale and in fueling further advancements in their deployment. The CPU is already vital in all AI systems, whether it is handling the AI workload entirely or in combination with a co-processor, such as a GPU or an NPU. As a result, there will be a heightened emphasis on the low power acceleration of these algorithms and the chips that run AI workloads in areas of intense compute power, like large language models, generative AI, and autonomous driving.

In 2024 we will also see even more advancements when it comes to running AI on the CPU, and the rise of AI at the edge, as the industry looks at how to deliver AI in a sustainable way and move data around more efficiently. There have been great strides in delivering the technologies needed for developers to create secure AI workloads at the edge, and we look forward to seeing what’s possible with increased on-device compute and AI in more cost-efficient solutions.

It is clear that, in every area, from sensors, smartphones, and software-defined vehicles, to data centers and supercomputers, the future of AI will need to be built on the world’s most advanced semiconductor technologies. The advancements of AI and chips are therefore intrinsically interlinked and will be a focal point for the whole technology industry in 2024.”

Chiplets

By Richard Grisenthwaite, EVP Chief Architect, Arm

“With foundry technologies advancing and Moore’s Law slowing down, the semiconductor industry needs to find new ways of realizing performance gains, cost reductions, and yield improvements. This is why chiplets will be a focus across the industry in 2024.

A chiplet is a silicon die that implements part of a system, designed to be combined to create larger and more complex systems that can be packaged and sold as a single component, meaning you can assemble a silicon solution from a number of smaller dies instead of one single larger monolithic die. This creates new design possibilities and new opportunities for composability: larger solutions can be assembled beyond the typical reticle limit, die size can be optimized for yield independent of the overall solution, and a given chiplet can be re-used in multiple types of solutions, creating a multi-vendor chiplet supply chain.

With chiplets, both new and existing players can access performance and differentiation opportunities, creating a new route to custom silicon for manufacturers who historically choose off-the-shelf solutions. As the proliferation of this technology increases and the chiplet marketplace becomes more diverse, the focus will shift towards standardization and interoperability to ensure the quickest path to market for these more customized chips, enabling reuse in different markets. In 2024, we expect to see the industry come together to more clearly define the system-level capabilities and foundational standards that will enable chiplets to be used in a wider variety of systems without risk of fragmentation.”

Category: Predictions

This entry was posted on Tuesday, January 16th, 2024 at 1:26 pm. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.