By Pim Tuyls, CEO, Intrinsic ID
Pim Tuyls
Looking Ahead: Security Trends for 2023
The world is becoming ever more connected through the internet of things (IoT) and reliant on these connections to drive communication, commerce, healthcare, and defense systems. At the same time, cyberattacks are on the rise. This drives the need for secure authentication, trusted communication, and data protection. Each device in the connected world must be safe and trustworthy; each data communication must be protected from eavesdropping; each embedded software program must be protected from reverse-engineering; the privacy of each piece of personal data must be preserved. This is a very complex problem that is only becoming more so as connected devices have begun to comprise numerous components from multiple manufacturers.
Happily, there is rapidly growing awareness that security is vital to keep the connected world that we all depend on safe and trustworthy. Here I will identify several trends that I believe will be driving the wider adoption of security solutions for the semiconductor market in 2023.
System-in-Package
Moore’s Law is reaching its limits, and with chip designs growing ever more complex, it is becoming increasingly difficult for many designs to fit onto a single die. This is either because of limitations to the reticle size for chip manufacturing or because it’s getting more complex and very expensive to scale a monolithic system-on-chip (SoC) down to a new technology node. The solution for these limitations in the production process is the system-in-package (SiP), where one package contains multiple individual chiplets, each with their own functionality. This approach results in lower cost and faster time-to-market, while enabling specific functions to be implemented at their optimal technology nodes. Because of these benefits, Gartner predicts that by 2026, 20% of all semiconductor devices shipped will incorporate advanced 3D packaging technology, up from less than 1% in 2021.
