By Christian Eder, Product Marketing Director, congatec
Christian Eder
COM-HPC Mini ushers in a new era
Coming at last: Design sprints from COM Express Compact to COM-HPC
The first COM-HPC Mini Computer-on-Modules will soon hit the market. The final ratification of the new COM-HPC Mini standard, expected for the first half of 2023, will solve the Gordian knot that developers of ultra-compact COM Express Basic systems have been facing.
Once available, COM-HPC Mini modules with 13th generation Intel Core processors (codename Raptor Lake) will complete the ecosystem open to developers of third generation modular high-end embedded and edge applications. An ecosystem which ranges from high-end Server-on-Modules to extremely compact Client-on-Modules that are barely larger than a credit card. Even the most space-constrained COM Express Compact and COM Express Mini solutions can benefit from a high-end performance boost and a significantly larger number of new high-speed interfaces provided from COM-HPC Mini. Thus, entire product families can migrate to the new PICMG standard – without requiring significant modification of the internal system design and housing despite the larger module and carrier board dimensions.
