90% of closures were ≤200mm wafer fabs; greatest number of closures in Japan.

The IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers.  In its recently released Global Wafer Capacity 2019-2023 report, IC Insights shows that due to the surge of merger and acquisition activity in the middle of this decade and with more companies producing IC devices on sub-20nm process technology, suppliers are eliminating inefficient wafer fabs. Over the past ten years (2009-2018), semiconductor manufacturers around the world have closed or repurposed 97 wafer fabs, according to findings in the new report.

Figure 1 shows that since 2009, 42 150mm wafer fabs and 24 200mm wafer fabs have been shuttered. 300mm wafer fabs have accounted for only 10% of total fab closures since 2009.  Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009.

Figure 1
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