Open side-bar Menu
 The Dominion of Design

Posts Tagged ‘packaging’

India’s Semiconductor Leap: A $15.2 Billion Bet on Technological Sovereignty and Global Ambition

Friday, March 1st, 2024

India’s recent approval of three semiconductor plants, representing a colossal investment of $15.2 billion, marks a significant leap towards its ambition of becoming a global hub for electronics manufacturing and design. This initiative not only underscores India’s strategic efforts to reduce its dependency on foreign semiconductor supplies but also highlights its push to claim a stake in the highly competitive and geopolitically sensitive semiconductor industry.

The announcement comes at a time when the global semiconductor industry is facing unprecedented demand coupled with supply chain bottlenecks, exacerbated by the COVID-19 pandemic and geopolitical tensions. Semiconductors, or chips, are integral components of a vast array of products, from basic consumer electronics to advanced defense systems, making them crucial for national security and economic growth. India’s entry into semiconductor manufacturing is not just about economic development but also about securing its position in the global supply chain and enhancing its technological sovereignty.

The projects involve two fabrication plants (fabs) and one packaging facility, with Tata Group and CG Power among the key investors, in collaboration with international partners such as Taiwan’s Powerchip, Japan’s Renesas Electronics, and Thailand’s Stars Microelectronics. The construction of these plants is expected to begin within the next 100 days, highlighting the urgency and priority the Indian government places on this sector.

(more…)

Reinventing Chip Design from the Outside In

Wednesday, May 26th, 2021

In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’

intel newsroom

Johanna Swan, Intel Fellow, Director of Package & Systemes Research, Components Research

In describing Intel’s foray into customer chipmaking through Intel Foundry Services and how it stands apart, Intel CEO Pat Gelsinger has repeatedly cited “our world-class packaging and assembly test technologies.” Gelsinger told investors last month that “we are seeing extreme interest in our packaging technologies” from potential foundry customers.

Packaging has never seen so much love.

But for Johanna Swan, deferred adoration goes with the job. As director of Package and Systems Research in Intel’s Components Research group, Swan says, “We have to anticipate what the future demands are and get focused on what we believe is going to have value — but it’s going to be five years-plus out.”

(more…)




© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise