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TSMC Unveils Next-Gen AI Semiconductor Technologies at 30th North America Symposium

Friday, April 26th, 2024

At the 30th North America Technology Symposium, TSMC, the industry leader in semiconductor manufacturing, unveiled a suite of advanced technologies that promise to significantly boost the performance and efficiency of artificial intelligence systems. The event, held in Santa Clara, California, marked a major milestone for TSMC, showcasing their continued commitment to innovation in a rapidly evolving tech landscape.

TSMC introduced the A16 technology, a breakthrough in nanosheet transistor design expected to enter production by 2026. This new technology leverages TSMC’s Super Power Rail architecture to enhance logic density and performance, specifically targeting high-performance computing products. The A16 technology promises an 8-10% speed improvement and a 15-20% reduction in power usage compared to its predecessors, positioning TSMC at the forefront of semiconductor technology.

Furthermore, TSMC announced the expansion of its N4 technology series with the N4C, an adaptation that offers a cost-effective solution for manufacturers, reducing die costs by up to 8.5%. This development is set to hit volume production in 2025, enabling a broader range of applications to benefit from advanced semiconductor technology.

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