EDACafe Industry Predictions for 2025 – AIM Solder

By David Suraski, Executive Vice President of Assembly Materials, AIM Solder

David Suraski

Innovation, Reliability, and Growth

Rapid advancements in miniaturization, high-reliability applications, and sustainability initiatives are reshaping the way we design, produce, and assemble electronic components. AIM Solder is uniquely positioned to lead in this evolution with cutting-edge products, robust global infrastructure, and a customer-first spirit

Technical Advancements Redefining 2025

Demand for finer pitch and miniaturized assemblies is at an all-time high, driven by applications in 5G, IoT, AI, and advanced consumer electronics. Finer solder pastes, such as type 5 and type 6 and even 7 and 8, are essential for precision in tighter spaces. AIM is not only ramping up production of these materials but conducting and sharing detailed studies to provide clear, actionable insights to the market.

High-reliability applications are another area of rapid growth. Aerospace, automotive, and medical industries require long-term performance under extreme conditions. In support of those requirements, AIM is developing a new high-reliability alloy with improved ductility and a melting temperature closer to tin-lead solders. This alloy represents a next generation solution, building on the success of existing products like our REL22 alloy.

Finally, step soldering and advanced packaging are driving demand for high melting point solders, such as Sn95Sb5. AIM’s upcoming solder paste product releases in this area will help manufacturers meet these demands without compromising efficiency or quality.

Customer Behavior and Market Trends

Electronics manufacturers are under increasing pressure to reduce waste, improve energy efficiency, and use environmentally friendly materials. AIM has long been a leader in this area, offering RoHS and REACH compliant materials, a suite of halogen-free products, and a thriving dross and scrap reclamation program. Our commitment to sustainability informs our product development and operational strategies, while also helping our customers achieve compliance.

Supply continuity is also a top concern for manufacturers, especially due to geopolitical uncertainties, labor shortages, and tariff changes. We remain confident, however, that our global footprint, built-in redundancy, and robust contingency planning make us a reliable partner in any market condition.

Meeting Evolving Customer Needs

AIM’s approach is rooted in proactive support and innovation. Our global applications labs simulate customer production environments, enabling precise process and material optimization. Combined with our 24/7 technical support, we ensure customers succeed—whether they’re adopting proven solutions or integrating emerging technologies.

Just one of many innovative products we’re proud of is our REL61 alloy. For several years, REL61 has helped manufacturers lower costs while achieving superior performance compared to SAC305 and other low/no-silver alloys. We’ve also seen great success with our high reliability REL22 alloy, which continuously outperforms standard and other “high reliability” alloys. These and many of our other great products and services demonstrate how we balance innovation with real-world practicality to deliver value to our customers.

Looking ahead, we will continue a strategy of adaptability and collaboration. Working closely with customers and partnering with industry organizations like iNEMI, IPC, SMTA, and others allows us to tailor our products and support services to meet a variety of specific and evolving needs.

Vision for 2025 and Beyond

AIM Solder is ready for the challenges and opportunities ahead. Our cutting edge, aggressive R&D department is advancing product innovation with new alloys, fine-particle pastes, and sustainable solutions. Our infrastructure and customer support are built to withstand disruptions and deliver value globally.

In 2025, AIM will continue to lead, helping our customers achieve more with reliable products and unparalleled support.

About Author:

Info@aimsolder.com

Bio: David Suraski is the Executive Vice President of AIM Solders’ assembly materials division. He has worked for the company in a variety of roles since 1997, including technical support, marketing, operations, and as the managing director of the company’s Asian business unit while based in China for 5 years. David has authored or co-authored dozens of published articles on topics ranging from lead-free soldering to reflow profiling to conflict metals. David has his B.A. from American University in Washington, D.C. and his MBA from Bryant University in Rhode Island.

Tags: advanced packaging solutions, fine-particle solder pastes, global supply continuity., high-reliability solder alloys, miniaturization in electronics, RoHS and REACH compliance, step soldering advancements, sustainable electronic materials

Category: Industry Predictions

This entry was posted on Tuesday, January 28th, 2025 at 6:40 pm. You can follow any responses to this entry through the RSS 2.0 feed. You can skip to the end and leave a response. Pinging is currently not allowed.