By David Suraski, Executive Vice President of Assembly Materials, AIM Solder
Innovation, Reliability, and Growth
Rapid advancements in miniaturization, high-reliability applications, and sustainability initiatives are reshaping the way we design, produce, and assemble electronic components. AIM Solder is uniquely positioned to lead in this evolution with cutting-edge products, robust global infrastructure, and a customer-first spirit
Technical Advancements Redefining 2025
Demand for finer pitch and miniaturized assemblies is at an all-time high, driven by applications in 5G, IoT, AI, and advanced consumer electronics. Finer solder pastes, such as type 5 and type 6 and even 7 and 8, are essential for precision in tighter spaces. AIM is not only ramping up production of these materials but conducting and sharing detailed studies to provide clear, actionable insights to the market.
High-reliability applications are another area of rapid growth. Aerospace, automotive, and medical industries require long-term performance under extreme conditions. In support of those requirements, AIM is developing a new high-reliability alloy with improved ductility and a melting temperature closer to tin-lead solders. This alloy represents a next generation solution, building on the success of existing products like our REL22 alloy.