Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

In a bold stride toward shaping the future of semiconductor design, Siemens Digital Industries Software has launched Calibre® 3DThermal, a groundbreaking tool aimed at advancing the development and verification of 3D integrated circuits (3D-ICs). This new software is set to redefine the landscape for thermal analysis, addressing the intricate challenges posed by next-generation 3D-IC architectures. The announcement comes at a time when the semiconductor industry faces increasing pressure to manage the escalating demands of heat dissipation and reliability in ever-smaller, more complex chip structures.

Calibre 3DThermal integrates seamlessly with Siemens’ renowned Calibre verification suite and leverages the Simcenter™ Flotherm™ software solver engine. This synergy enables chip designers to model, visualize, and mitigate thermal effects from early-stage exploration to final design signoff. This comprehensive approach allows for accurate thermal analysis across entire 3D assemblies, ensuring that issues such as thermal hotspots and material stresses are addressed proactively, well before they threaten design integrity or reliability.

“Historically, single-die designs followed a clear path from concept to tape-out, with well-understood processes to ensure reliability,” explained John Ferguson, Product Management Director for Calibre nmDRC at Siemens, during a recent interview with EDACafe’s Sanjay Gangal. “However, the shift to 3D-ICs introduces new physical phenomena, including thermal effects and mechanical stresses, which can no longer be overlooked.” These issues, Ferguson noted, stem from the complex interactions of multiple chiplets often built with different processes and materials, stacked and interconnected to create a unified circuit.

Ferguson highlighted that in 3D-ICs, power consumption can lead to significant heat generation, which must be effectively managed. Unlike single-die designs, where the heat could dissipate through a large silicon substrate, 3D-ICs involve numerous smaller chiplets, each potentially producing heat independently. “The thermal behavior can impact not only transistor performance but also the integrity of the entire electrical network,” he explained.

Calibre 3DThermal was designed with these challenges in mind. By combining geometric and electrical data from the Calibre suite with the thermal analysis prowess of Simcenter Flotherm, Siemens created a tool capable of assessing how heat affects chip behavior comprehensively. This innovation allows for early-stage feasibility studies with minimal input and evolves to detailed thermal modeling that includes factors like metalization and TSVs (through-silicon vias) as the design progresses.

“We’re empowering designers to address thermal challenges directly within their design flow,” Ferguson said. “Calibre 3DThermal feeds thermal analysis results back into the design process, enabling simulations that account for timing, signal integrity, and overall performance impacts. This way, designers can implement necessary changes iteratively, long before the final signoff.”

The tool’s ability to simulate complex 3D-IC assemblies with precision is particularly critical as the industry explores heterogeneous integration, where multiple technologies coexist within a single package. This approach demands an acute understanding of how different materials and chiplets interact thermally and mechanically. By integrating Calibre 3DThermal into their workflow, design teams can quickly identify potential problem areas and apply targeted solutions—such as adjusting floorplanning, adding thermal vias, or optimizing power distribution networks—to prevent costly design revisions.

Beyond thermal analysis, Siemens is also set to introduce a related tool for mechanical stress analysis, anticipated for release in early 2025. According to Ferguson, mechanical stresses—especially when combined with thermal effects—pose another layer of complexity that designers must mitigate to ensure reliable chip performance. “Mechanical stress impacts transistor behavior, and when you’re stacking chiplets or integrating new materials, those stresses become non-trivial,” he added.

Siemens’ commitment to innovation doesn’t stop at its software development. The company has partnered with key industry players, such as UMC (United Microelectronics Corporation), to tailor Calibre 3DThermal specifically for cutting-edge wafer-on-wafer and 3D-IC technologies. “By collaborating with foundries, we can ensure that the data needed for accurate analysis is protected and encrypted,” Ferguson emphasized. This collaboration secures sensitive data while allowing for robust design verification.

Partnerships with leading foundries such as TSMC, Samsung, and Intel Foundry have also been pivotal in refining Calibre 3DThermal. These collaborations enable Siemens to validate the tool against the most advanced process technologies, down to 2-nanometer nodes and beyond. The participation of these industry leaders ensures that the software’s outputs align with real-world manufacturing conditions, providing designers with the confidence that their analysis results are both accurate and actionable.

In addition to technical advancements, Siemens has focused on ease of use. Calibre 3DThermal integrates smoothly into existing design environments, displaying analysis results through the familiar Calibre RVE results viewer and supporting visualization within place-and-route and custom layout tools. “By making the thermal data easily accessible and interpretable, we’re enabling designers to make informed decisions without needing to be experts in thermal dynamics,” Ferguson noted.

In a lighter moment during the interview, Ferguson shared personal insights about his life outside of work, revealing his passion for golf, music, and spending time with his family, which recently welcomed a new grandson. His journey into collecting baseball caps, sparked by thoughtful gifts from his children, adds a human touch to the portrait of an industry leader dedicated to pushing the boundaries of chip design.

Calibre 3DThermal’s release marks a significant step forward for semiconductor engineers aiming to harness the potential of 3D-ICs while navigating the formidable challenges of thermal management. As Siemens’ solution sets a new standard in IC design, it signals a future where innovation is not only possible but seamless, enabling designers to push the limits of performance and reliability.

Tags: 3D-IC design, chiplet integration, semiconductor innovation, Siemens Calibre, thermal analysis, thermal management

Category: Siemens

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