In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’
Johanna Swan, Intel Fellow, Director of Package & Systemes Research, Components Research
In describing Intel’s foray into customer chipmaking through Intel Foundry Services and how it stands apart, Intel CEO Pat Gelsinger has repeatedly cited “our world-class packaging and assembly test technologies.” Gelsinger told investors last month that “we are seeing extreme interest in our packaging technologies” from potential foundry customers.
Packaging has never seen so much love.
But for Johanna Swan, deferred adoration goes with the job. As director of Package and Systems Research in Intel’s Components Research group, Swan says, “We have to anticipate what the future demands are and get focused on what we believe is going to have value — but it’s going to be five years-plus out.”
