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Archive for June 24th, 2021

New fabs; Intel reorganization; ML in FPGA design; thermal model standard; reducing via resistance

Thursday, June 24th, 2021

According to industry association SEMI, semiconductor manufacturers around the world will start the construction of nineteen new high-volume fabs by the end of this year, and ten more fabs will be added in 2022. So it’s no surprise that several announcements this week concern new fabs. Besides rumors about a new European site, Intel is in the news also for its organizational changes that – to some extent – reflect the growing importance of AI and hyperscale data centers. Among other news is a further advancement of machine learning in EDA-related technologies, namely FPGA design tools; and a new manufacturing process enabling further scaling.

Intel reportedly in talks on a new fab near Munich, Germany

Intel is reportedly in talks with the German state of Bavaria to build a new fab, with the goal of countering the chip shortage that is damaging the automotive industry. According to the report, in recent months Intel has been seeking 8 billion euros (US$9.5 billion) in public subsidies to build a semiconductor manufacturing site in Europe. Reportedly, the Bavarian Economy Minister is strongly supporting the initiative. The Bavarian government has suggested a disused air base in Penzing-Landsberg, west of Munich, as a possible location for the factory. The German state of Bavaria is home to carmaker BMW, and the Munich area is a significant semiconductor manufacturing hub, hosting – among others – a large Texas Instruments factory.

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