Senior Product Marketing Manager for circuit simulation products at Synopsys.
Call for papers for IEEE 2013 WMED conference
September 26th, 2012 by Hélène Thibiéroz
Just a quick call for papers for 2013 WMED, which is scheduled to take place on Friday, April 12, 2013 in the Student Union Building of Boise State University. http://www.ewh.ieee.org/r6/boise/wmed2013/WMED2013.html
Synopsys is currently a platinum sponsor for 2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). This conference provides a forum for reviewing and discussing all aspects of microelectronics including processing, electrical characterization, design, and new device technologies. This workshop will consist of invited talks, contributed papers, tutorials, as well as a poster session throughout the afternoon.
I therefore asked Tim Hollis, general chair of WMED to provide us with more insights on this conference.
Timothy M. Hollis received the B.S. degree in electrical engineering from the University of Utah, Salt Lake City, UT, in 2003 and the Ph.D. degree in Electrical Engineering from Brigham Young University, Provo, UT, in 2007, where his graduate work focused on channel equalization and jitter attenuation circuits for high-speed serial interconnects. As a graduate student he interned with Micron Technology, Inc., Boise, ID, and Intel Corporation’s Circuit Research Laboratory, Hillsboro, OR. Following graduation he joined Micron’s Advanced Architecture Group, where his duties have included I/O circuit design and signal integrity and power delivery analysis for multi-gigabit-per-second memory interfaces. He is currently a Senior Member of the Technical Staff and holds 29 issued patents (22 pending). Tim has served in several positions within the IEEE WMED organizing committee, from Program Chair and Publicity Chair to the Technical Chair in 2012. Currently he serves as the General Chair for WMED 2013.
Q- First, Tim, thanks for being a guest on this blog. Could you give us more background on this conference?
Tim- Thanks for asking Helene. The WMED was born out of the Boise Chapter of the IEEE Electron Devices Society, which was originally formed in 1998 under the direction of Dr. Stephen Parke of Boise State University. In the early years, the Chapter invited several distinguished lecturers to Boise to address the local engineering community. Then in 2002, the Chapter Officers decided to organize a symposium style, single-day event, which in its first year attracted 105 registered attendees. While the Workshop changed its acronym from uE-ED to WMED in 2004, over its eleven year lifetime, it has maintained the same single-day format, but has grown in popularity and attendance, with as many as 450 attendees anticipated in 2013. In spite of its modest budget, the WMED has brought international recognition to the Boise Section of the EDS, which over the last decade has received the EDS Section of the year award twice. The ability to maintain a low registration fee ($55 for IEEE members and $80 for non-IEEE members in 2013) has been enabled through the generous support of academic and industry sponsors like Synopsys.
The scope of the Workshop is fairly broad, with invited talks and tutorials generally touching on everything from emerging memory devices and technologies, to high-speed circuit design. Last year we enjoyed a Keynote covering advances in Bio-electronics delivered by Dr. Rahul Sarpeshkar of MIT, and this year’s Keynote will be on the topic of Next Generation Photolithography and will be given by a thirty veteran of the field of lithography, Dr. Chris Mack – the “litho-Guru.”
Because the WMED is the only regularly-occurring event of its kind in the vicinity, the audience is generally made up of industry professionals and academics (faculty and students) from the northwestern United States, with the largest groups of attendees historically coming from Boise State University and Micron Technology, Inc. In addition, we invite local high school students interested in science and engineering to enjoy the WMED Keynote, and then participate in a parallel program specifically tailored to encourage them in their pursuit of careers in technology.
Q-What can attendees expect and get from this conference?
Tim- Attendees of the Workshop will be exposed to cutting-edge research and advances from all areas of Microelectronics. While the 2013 program is still being organized, we can already announce tutorials in the areas of power-efficient circuits for high-speed channel equalization and MEMS applications, packaging and reliability. We also expect presentations in the areas of 3-D Integration, Resistive-RAM and Advanced CMOS device technologies and materials, Memory Architectures for High Performance Computing, and Solid State Drive architectures.
In addition to the invited talks and tutorials, the WMED program includes contributed paper sessions and an afternoon poster session. Authors of accepted papers are invited to present their work, which is subsequently published and indexed within the online IEEE xPlore database.
As far as networking is concerned, WMED attendees have time to interact in the morning during the continental breakfast, then again during the program intermissions and throughout the lunch banquet. Finally, they will enjoy about an hour to visit during the afternoon poster session, after which prizes are raffled off to registered attendees (prizes have included Micron/Crucial-donated Solid State Drives).
In the meantime, we welcome anyone who is interested to join the WMED 2013 LinkedIn group at: http://www.linkedin.com/groups/IEEE-WMED-2013-4558222?home=&gid=4558222&trk=anet_ug_hm
Q-What is the review and acceptance process?
Tim- The submission deadline for four-page contributed papers is Friday, January 11, 2013, and following the peer-review process, authors will be notified of paper acceptance by Friday, February 1, 2013. Details on paper submission guidelines, including the IEEE-approved template can be found on the Call for Papers page of the WMED website (http://www.ewh.ieee.org/r6/boise/wmed2013/CallforPapers.html). A portion of the paper submissions may be recommended for the afternoon Poster Session, in which case only the abstracts will be indexed within the IEEE database. We will also accept direct submissions to the poster session in abstract-only form.
Thanks Tim for those valuable insights !
Next blog posts on verification, how to address ESD and future tutorial for DesignCon. Stay posted ! 🙂