IPC ESTC - Call for Papers
[ Back ]   [ More News ]   [ Home ]
IPC ESTC - Call for Papers
Electronic System Technologies Conference & Exhibition
May 20–23, 2013
The New Tropicana · Las Vegas, Nevada · www.ipc.org/ESTC

Call for Papers and Course Proposals
Deadline: November 5, 2012

The IPC Electronic System Technologies Conference (ESTC) invites you to submit an abstract and/or Professional Development Course (PDC) proposal.

Sponsored by IPC — Association Connecting Electronics Industries®, producer of IPC APEX EXPO®, the premier trade show and conference for the printed board and electronics manufacturing industries, the IPC Electronic System Technologies Conference (ESTC) is uniquely positioned to attract the entire electronics industry from components to board assemblies and to complete systems. ESTC is an excellent opportunity not only to broaden your range, but also to go deeper in emerging areas.

Attendance is encouraged for representatives from:
  • OEMs (Original Equipment Manufacturers)
  • IDMs (Integrated Device Manufacturers)
  • Fabless semiconductor companies
  • Semiconductor foundries
  • Outsourced Semiconductor Assembly Test Services (OSATS)
  • Electronics Manufacturing Service (EMS) providers
  • Original Design Manufacturers (ODMs)
  • Equipment, materials and service providers
  • Academia and research centers
TECHNICAL CONFERENCE — ABSTRACTS
May 21–23, 2013

The conference is accepting abstracts containing data-based claims, nonconfidential, noncommercial and without copyright on the following topics:
  • Product design and development
  • Assembly and SMT
  • PCB fabrication, materials and design
  • Quality and reliability
  • Fab and silicon
  • Test
  • Equipment, tools and modules
  • Packaging and substrates
  • Mechanics
  • Thermals
  • Electrical
  • Materials
  • Industry analysis and issues
Submit an abstract of 250 to 500 words that describes the scope, content and key points of your proposed paper. Final manuscripts, no more than six pages long, are due in final form for publication in the conference proceedings by February 25, 2013.

For additional information regarding abstract submission, contact:

General Chair
Email Contact
Intel Corporation
Phone: +1 480-552-4898
SUBMIT YOUR PAPER ABSTRACT


PROFESSIONAL DEVELOPMENT (PD) COURSES
May 20, 2013

Submit proposals for four-hour courses that cover fundamental and emerging areas appealing to recent college graduates or experienced professionals. Each selected course instructor will be given a minimum honorarium of $1,500; course instructors will be offered registration at a discount.

For additional information regarding a PD course proposal submission, contact:

PD Secretary
Hannah Chung, Ph.D.
Medtronic, Inc.
Phone: +1 480-929-5485
SUBMIT YOUR PD COURSE PROPOSAL
EXHIBITION AND SPONSORSHIPS
May 21-22, 2013        

Reserve your space in the exhibit hall where suppliers and key buyers will come together.

For additional information regarding exhibition and sponsorship opportunities, please contact:

Email Contact
Manager, Trade Shows & Events
IPC — Association Connecting Electronics Industries®
Phone: +1 847-597-2866
Fax: +1 847-615-5666

MEDIA SPONSORS: ASSOCIATION SUPPORTER:
circuitnet SEMICONDUCTOR PACKAGING AND CIRCUITNET
GSA
ORGANIZER:
ESTC is produced by IPC — the Association Connecting Electronic Industries®, a nonprofit global industry association dedicated to the competitive excellence and financial success of its more than 3,100 member companies. IPC represents all facets of the industry, including design, printed board manufacturing, electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. Headquartered in Bannockburn, IL; IPC maintains additional offices in Arlington, VA; Taos, N.M.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.