Offers easy connection with wireless devices, adds communication function to standalone devices

TOKYO — (BUSINESS WIRE) — July 15, 2014 — Toshiba Corporation (TOKYO:6502) today announced the launch of “T6NE7”, a tag IC compliant with NFC^[1] Forum Type 3 Tag^[2], with embedded wired interface. Sample shipments start today, with mass production scheduled to start in Aug, 2014.

Recently, more and more products support wireless communication over Bluetooth^®[3] or wireless LAN. Toshiba’s new tag IC supports this trend. It is compliant with NFC Forum Type 3 and embedded with a wired interface that communicates with a host microprocessor, and realizes easy connection with wireless products by writing and reading the necessary data onto embedded non-volatile memory in the tag. This avoids the complicated data input and operation previously required before, and brings Near Field Communication to normally standalone products, such as calculators, clocks, and health care products.

The new product was developed with enhanced IC card technology, including analog technology and non-volatile technology established in the course of Toshiba’s 20 years’ experience in product development and sales.

Even though the chip is small, it integrates 2.0K bytes ^[4] non-volatile memory that it can allocate to the available memory area in the wired mode, and that also can be used as an external memory to store information to control the host microprocessor in the wireless device.

Sample software to control host microprocessor for new product is available from today.

Note 1		NFC (Near field communication)
Note 2		Produced under license of Sony Corporation’s FeliCaTM Lite-S technology.
Note 3		Bluetooth® is a trademark owned by its proprietor and used by Toshiba under license.
Note 4		Within the 2.0K byte, about 1.5K byte of general user area with error correction circuits is included.

Key Features of the new product

• Compliant with NFC Forum Type 3 Tag
• Low power consumption: Stand by current 0.1μA (Typ.) (by turning off internal power.)
• Non-volatile memory capacity: 2.0K byte (including about 1.5 K byte general user area.)
• Security: Mutual recognition using Triple DES MAC.(MAC: Message Authentication Code)
• Optional wired interfaces: UART, I²C, SPI
• Power supply: power-generation function by wireless carrier or external power supply is selectable.
• Start-up signal for host: carrier detection (at external power-supply operation), command response completion signal (at wireless power-supply operation)
• External power supply terminal: 2.4V 300μA external output terminal (at wireless power-supply operation)
• Three communication modes: Tag standalone wireless communication mode, wired mode, through mode to connect the host from wireless.

Applications

Pairing with other NFC products (wearable products, healthcare products, general wireless data communication products (remote controllers)), and as a wireless interface to standalone products (calculators, clocks, etc.).

Main specifications
Part Number		T6NE7
Supply Voltage		1.8V–3.6V
Operation Current		500μA(Typ.) (EXVDD 3.3V)
Standby Consumption Current		0.1μA(Typ.) (EXVDD 3.3V)
Communication Protocol		NFC Type 3 Tag
Communication Speed		212kbps/424kbps automatic selection
Wired Interface		UART (max154kbps), I2C (400kHz), SPI (1.7Mbps)
Non-volatile Memory		2Kbyte (including about 1.5Kbyte of general user area implemented with error correction circuit)
Security		Mutual recognition by Triple DES MAC (MAC: Message Authentication Code)
Other Features		Voltage generation function by RF (by selecting terminal connection) CRC automatic generation at data write and check at data read. Internal RAM can relay data from wireless to wired device and vice-versa. RF generation voltage can be regulated and supplied to an external device.
Operating Temperature		-30 to 85℃
Package		TSSOP16 0.65mm pitch / QFN20 (4mm×4mm, 0.5mm pitch: under planning) Also available as wafers or as bare chips on chip trays.

Customer Inquiries:
Mixed Signal IC Sales & Marketing Department
Tel: +81-44-548-2821

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba

Toshiba Corporation, a Fortune Global 500 company, channels world-class capabilities in advanced electronic and electrical product and systems into five strategic business domains: Energy & Infrastructure, Community Solutions, Healthcare Systems & Services, Electronic Devices & Components, and Lifestyles Products & Services. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations towards securing “Growth Through Creativity and Innovation”, and is contributing to the achievement of a world in which people everywhere live in safe, secure and comfortable society.

Founded in Tokyo in 1875, today’s Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide, with annual sales surpassing 6.5 trillion yen (US$63 billion).
To find out more about Toshiba, visit www.toshiba.co.jp/index.htm

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Contact:

Media Inquiries:
Toshiba Corporation
Semiconductor & Storage Products Company
Chiaki Nagasawa, +81-3-3457-4963
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