ScanXY allows engineers to quickly link structural test data mismatches to their physical domains. The viewing capabilities of ScanXY show the XY location where test failures and subsequent "hot spots" are taking place. ScanXY runs without third party intervention, either independently or in conjunction with the Teseda WorkBench (TWB) software.
ScanXY benefits go beyond the production phase of testing as already proven by major customers. ScanXY has also been utilized in validating the completeness of physical design data for pre-silicon sign-off. Currently, two large multinational semiconductor companies have mandated ScanXY as part of their sign off process.
"Engineers will find the ease of physical location identification as an enabler for faster silicon debug times, where the communication between design teams and their foundry partners are also significantly improved in resolving yield limiting problems," said Armagan Akar, CEO of Teseda. "This is the first phase in an exciting year of new product introductions and customer growth for Teseda."
About Teseda Corporation
Teseda provides a unifying software environment that allows multiple engineering disciplines to accelerate the delivery of first silicon. Teseda's software solutions deliver comprehensive diagnostic and debug capabilities that resolve yield limiting failures, reducing the time to volume production. Teseda software runs on desktop engineering testers and large production equipment and supports multiple EDA/ATE systems. Teseda is headquartered in Portland, Oregon. For more information about Teseda, its products, and distribution network, please call 503.233.3315 or visit www.teseda.com.
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