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Broadcom Inc. Announces Second Quarter Fiscal Year 2019 Financial Results, Quarterly Dividend and Updated Guidance

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Renesas Electronics Develops New Processing-In-Memory Technology for Next-Generation AI Chips That Achieves AI Processing Performance of 8.8 TOPS/W

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TTM Technologies, Inc. Announces Acquisition of Assets from i3 Electronics, Inc.

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USB Type-C Port Switch from Diodes Incorporated Enables Latest Mobile Devices to Continue Supporting Legacy Data and Audio Signals

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Renesas Electronics Develops New Flash Memory Technology Achieving Larger Capacities, Faster Read Operation, and OTA Support in Automotive Microcontrollers Based on Next-Generation 28nm Process

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Renesas Electronics Develops Low-Power Technology for Embedded Flash Memory Based on SOTB™ Process to Enable Energy Harvesting and Eliminate Need for Batteries

Juliano Mologni, Lead Product Manager ANSYS

Scott Best, Senior Director Rambus

Roger Levinson, COO BrainChip

EDACafe Editorial by Roberto Frazzoli TSMC to get CHIPS Act funding; Google’s Arm-based CPU; evolutionary algorithms in AI; Huawei’s growing importance

EDACafe Editorial by Sanjay Gangal Navigating the Future: CadenceLive Reveals a Transformative Vision in Semiconductor and System Design

Bridging the Frontier by Bob Smith, Executive Director Great Lineup of Speakers Highlights CEO Executive Outlook May 9 at Keysight

EDACafe Editorial by Sanjay Gangal Homegrown AI Tools at Intel Shorten Design Cycles from Weeks to Hours

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North America Technology Symposium at Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA - Apr 24, 2024

IP-SOC Silicon Valley 24 at Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara CA - Apr 25, 2024

MEMS & Sensors Technical Congress - MSTC 2024 at University of California, Los Angeles 405 Hilgard Avenue, Covel Commons in Sunset Village, Housing at Luskin Center Los Angeles CA - May 1 - 2, 2024

ChipEx2024 at Tel-Aviv Expo Center & Hilton Hotel Tel-aviv Israel - May 7 - 8, 2024