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Xilinx Updates December Quarter Sales Guidance

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Xilinx Underscores Commitment to Growth in China at Grand Opening of Expanded Beijing Site, New R&D Center

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Xilinx CTO Ivo Bolsens to Deliver Keynote at 3-D Architectures for Semiconductor Integration & Packaging Conference

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Xilinx Announces Key Connectivity IP Cores for Next Generation LTE and LTE-A Wireless Infrastructure Equipment

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Xilinx ISE Design Suite 13.3 Full Custom Precision Floating-Point Support Extends Productivity for DSP Designers

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Xilinx Ships World's Highest Capacity FPGA and Shatters Industry Record for Number of Transistors by 2X

Juliano Mologni, Lead Product Manager ANSYS

Melika Roshandell & Sherry Hess Cadence

Nathan Tracy, Technologist TE Connectivity

EDACafe Editorial by Roberto Frazzoli TSMC to get CHIPS Act funding; Google’s Arm-based CPU; evolutionary algorithms in AI; Huawei’s growing importance

EDACafe Editorial by Sanjay Gangal Navigating the Future: CadenceLive Reveals a Transformative Vision in Semiconductor and System Design

Bridging the Frontier by Bob Smith, Executive Director Great Lineup of Speakers Highlights CEO Executive Outlook May 9 at Keysight

EDACafe Editorial by Sanjay Gangal Homegrown AI Tools at Intel Shorten Design Cycles from Weeks to Hours

Industry Predictions by Sanjay Gangal Intel Sets New Paradigms in Enterprise AI with Launch of Gaudi 3 at Intel Vision 2024

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North America Technology Symposium at Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA - Apr 24, 2024

IP-SOC Silicon Valley 24 at Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara CA - Apr 25, 2024

MEMS & Sensors Technical Congress - MSTC 2024 at University of California, Los Angeles 405 Hilgard Avenue, Covel Commons in Sunset Village, Housing at Luskin Center Los Angeles CA - May 1 - 2, 2024

ChipEx2024 at Tel-Aviv Expo Center & Hilton Hotel Tel-aviv Israel - May 7 - 8, 2024