DesignCon 2009 Tutorial:
Practical Techniques for Understanding, Modeling, and Efficiently Suppressing the Noise Coupling through Chip, Package, and PCB in Mixed-Signal Integrated Circuits and Systems on Chip
Monday, February 2 | 9:00 am – 12:00 pm, Santa Clara, California, USA
Cosmin Iorga, Ph.D., Founder and President, NoiseCoupling.com, http://www.noisecoupling.com
The understanding of noise coupling phenomena is essential to semiconductor design engineers who must deal with the challenges of integrating more and more functionality on a single chip. This tutorial provides a practical approach to the analysis of noise-coupling mechanisms at device, chip substrate, package, and PCB levels; the implementation of efficient suppression techniques; and the simulation of noise coupling in various stages of the design flow. In addition to conventional suppression and simulation techniques, circuit-level noise cancellation methodologies and practical procedures for modeling the noise coupling early in the architectural stages of the design are also presented.
For more information visit: http://www.noisecoupling.com
or DesignCon 2009 web site: http://www.designcon.com/2009/attendees/schedule.asp