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(Unregistered)
07/07/16 03:27 AM
A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST Report this article as Inappropriate to us !!!Login to Reply

A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST-EFFECTIVE INTERPOSER CONSORTIUM TO ADVANCE CHIP PACKAGING SOLUTIONS FOR HIGH-VOLUME MANUFACTURING


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Juliano Oliveira
(Unregistered)
07/07/16 03:27 AM
Juliano Oliveira new Report this article as Inappropriate to us !!!Login to Reply

Excellent initiative about the future system-on-chip/system-in-package manufacturing reduction costs and technology improvement.
Unfortunately this initiative is addressing only FPGAs and GPUs application, it will be very interesting to have such initiative about silicon photonics together with CMOS ASIC system-in-package integration


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