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-> International Microwave Symposium (IMS) 2012
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Electrical-Thermal Coupled Solutions for Flip Chip Designs
AWR
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Electrical-Thermal Coupled Solutions for Flip Chip Designs
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Fully Integrating 3D EM Simulation into Circuit Simulation
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Improve Microwave Circuit Design Flow
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Linking RF Design Thru to Test
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Optimizing the Design and Verification of 4G RF PA's
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RF Link Prediction - A New and Novel Approach
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RF System Design - Moving beyond a Linear Datasheet
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Simulating an NXP Doherty PA with DPD
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IMS 2012 MicroApps - System Simulation Featuring Signal Processing Blocks
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Total : 9
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