June 29, 2009
Autosar and VSA from Mentor Graphics
Please note that contributed articles, blog entries, and comments posted on EDACafe.com are the views and opinion of the author and do not necessarily represent the views and opinions of the management and staff of Internet Business Systems and its subsidiary web-sites.
Jack Horgan - Contributing Editor


by Jack Horgan - Contributing Editor
Posted anew every four weeks or so, the EDA WEEKLY delivers to its readers information concerning the latest happenings in the EDA industry, covering vendors, products, finances and new developments. Frequently, feature articles on selected public or private EDA companies are presented. Brought to you by EDACafe.com. If we miss a story or subject that you feel deserves to be included, or you just want to suggest a future topic, please contact us! Questions? Feedback? Click here. Thank you!


SpringSoft and TSMC Commence Joint Development of Multi-Node Process Design Kit Portfolio SpringSoft announced a multi-year technology agreement with TSMC to jointly develop and validate process design kits (PDKs) for leading-edge chip manufacturing technologies. The collaboration between the two companies is driven by customer demand for SpringSoft PDKs and their mutual support of interoperable PDKs as the long-term goal for providing custom chip designers with the ultimate in manufacturing flexibility, technology choice, and design productivity.



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Other Embedded, IP & SoC News



































Texas Instruments introduces industry's smallest integrated load switch




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-- Jack Horgan, EDACafe.com Contributing Editor.




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