March 02, 2009
The Future of EDA and the Semiconductor Industry, One Man’s View
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Jasper Design Automation Raises $7 Million in Series D Funding Jasper announced it has raised $7 million in Series D financing. The investment round was led by new investor, ZenShin Capital of Menlo Park. Joining the financing were existing investors: Accel Partners, Cambrian Ventures, Foundation Capital, InnovationsKapital, and Northzone Ventures. The funds will provide working capital to support Jasper’s self-sufficient operations and continued market and product expansion.
customers with a unique solution that blends Blaze DFM’s design technology with special tuned advanced semiconductor processes to improve power consumption.
Other EDA News
Synopsys CEO Aart De Geus to Speak at Morgan Stanley Technology Conference
Arena Solutions Announces Record Growth in New Bookings and Net Retention for the Fourth Quarter and Fiscal Year 2008
QThink Design Services Adopts Magma's Titan and Talus to Implement Next-Generation Mixed Signal Designs
Open Text Helps to Reduce Infrastructure Costs and Improve Remote User Experience with Release of Exceed onDemand 7
20 Electronics Industry Leaders Collaborate to Accelerate Development and Adoption of Design for e-beam Technology
Srikanth Chandrasekaran to Receive Accellera's 2009 Technical Excellence Award at DVCon on Wednesday, February 25, 2009, Doubletree Hotel, San Jose, California
Magma's Latest Version of Talus Vortex Delivers Industry-Best Quality of Results for Advanced Designs (Magma)
Agilent Technologies Announces High-Frequency/High-Speed EDA Release for Integrated Circuit, Package and Board Co-Design
SpringSoft Agrees to Acquire Certess
Industry's First Low Power Verification Methodology Manual, Authored by ARM, Renesas Technology and Synopsys, is Now Available
Jasper Design Automation Introduces Design Activation Services To Promote IP and Design Reuse, Driving Higher Customer ROI
Accellera Invites EDA Community to Attend Its Luncheon, OVL Survey and Technical Excellence Award Presentations at DVCon
Magma Enhances SiliconSmart With New Functional Recognition Capabilities, Speeding Modeling of Complex Standard Cells and I/Os
Synopsys Posts Strong Financial Results for First Quarter Fiscal Year 2009
Mentor Graphics’ Walden Rhines and Intel’s Paolo Gargini Receive Prestigious IEC Fellow Awards at DesignCon 2009
Independent BDTI Benchmarks Recognize CEVA-TeakLite-III as Most Area Efficient and Energy Efficient of all Processors in Its Class
Other Embedded, IP & SoC News
Toshiba Adds 40V, 60V and 80V MOSFETs for Isolated DC-DC Bus Converters Using Sixth Generation High Speed Process for High Power Efficiency
STMicroelectronics Increases Power Output of Portable Stereo Amplifiers Featuring 3D Audio Capabilities
Atmel Introduces the First IEEE P802.15.4c Compliant RF Transceiver Tailored to the Chinese Wireless Market
Lime Microsystems selects Jazz Semiconductor’s 0.18-micron SiGe process for its Configurable Multi-band, Multi-standard Transceiver Targeting WCDMA, CDMA, LTE and WiMAX Femtocells
Maxim and Universal Electronics Purchase Zilog Universal Remote Control and Secure Transaction Businesses
NextIO Adopts Denali's Verification IP for New PCI Express Expansion and I/O Virtualization Module for Blade Systems
ON Semiconductor Launches 6-Watt LED Driver with Integrated DC-DC Boost Converter for Larger LCD Panel Backlighting
TSMC and Tela Innovations Announce Strategic Partnership to Enhance Design and Process Co-Optimization
In Another Favorable Preliminary Ruling, U.S. Patent & Trademark Office Rejects All Claims of Third Patent Asserted Against Aruba Networks by Motorola
Sundance SMT712 Module Optimized for High Bandwidth Applications Enabled by PXI Express. Expands SundancePXI Express Multiprocessor Solutions
Accordance Launches 1U Height M200 eSATA/SATA RAID Controller with Two 2.5 Inch Laptop Drives for industrial and embedded applications
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-- Jack Horgan, EDACafe.com Contributing Editor.