December 17, 2007
Apache Design Plus Optimal Equals?
Please note that contributed articles, blog entries, and comments posted on are the views and opinion of the author and do not necessarily represent the views and opinions of the management and staff of Internet Business Systems and its subsidiary web-sites.
Jack Horgan - Contributing Editor

by Jack Horgan - Contributing Editor
Posted anew every four weeks or so, the EDA WEEKLY delivers to its readers information concerning the latest happenings in the EDA industry, covering vendors, products, finances and new developments. Frequently, feature articles on selected public or private EDA companies are presented. Brought to you by If we miss a story or subject that you feel deserves to be included, or you just want to suggest a future topic, please contact us! Questions? Feedback? Click here. Thank you!

While many firms could possibly compete wit Apache, which ones do you see today as competitors?

Today, we compete will all the big vendors just like any other EDA solution provider. We compete with every one and we continue to execute. We have not lost any technical benchmarks in a long period of time. Out major customers continue to invest in Apcahe getting more license that are require for their next generation of design. That drives our consecutive record quarters. Our business is a strong indication of our competitive position in the market today. I believe that is the biggest endorsement.

What is the list price of the some of the various products?

We won’t give out that information for public access.

Would you like to expand on the capabilities of the second generation product under development?

No. We will spend more time in the near future to give more information about the second generation, its approaches and benefits but not on this call.

The top articles over the last two weeks as determined by the number of readers were:

Open SystemC Initiative Advances IP Interoperability and Reuse with New Draft Standard for Transaction-Level Modeling. The Open SystemC Initiative (OSCI), an independent non-profit organization dedicated to supporting and advancing SystemC as an industry standard language for ESL design, today announced the milestone release of the new transaction-level modeling standard, TLM-2 draft 2. This standard enables model interoperability and reuse at the transaction level, providing an essential framework for
ESL design. The public review period is now open to the worldwide SystemC community and ends on January 31, 2008. SystemC users, ESL tool developers and IP providers are encouraged to participate and provide feedback. The TLM-2 draft 2 kit is made available under open source license and includes a requirements specification, documentation, library and examples. To download, visit

Real Intent, Inc. announced that it is shipping a new version of its Ascent™ software for automatic formal verification of electronic designs. Ascent finds bugs in Register-Transfer-Level (RTL) designs and improves design quality, with significantly higher performance when compared to Real Intent's previous generation of automatic verification software, Implied Intent Verification. Ascent is shipping now, was first introduced in 2006, and replaces Real Intent's Implied Intent Verification software. The price starts at $35,000 for a one year term license. Existing customers on active maintenance receive Ascent at no charge.

Verigy Signs Agreement to Acquire Inovys announced that they have signed a definitive agreement for Verigy to acquire Inovys. Inovys, privately held, provides innovative solutions for design debug, failure analysis and yield acceleration for complex semiconductor devices and processes. Financial details were not disclosed. The acquisition is expected to be final in 30 to 60 days, subject to certain closing conditions.

ATopTech Signs Multi-year, Multi-million Dollar Contract with Broadcom ATopTech, Inc. announced that it has entered into a multi-million dollar per year, multi-year contract with Broadcom Corporation, a global leader in wired and wireless broadband communications semiconductors. Broadcom will use ATopTech's next generation place and route software for designing integrated circuits at 65nm and below. Broadcom's first chip using ATopTech's software has already taped-out and had first pass silicon
success. On the same day ATopTech launched the company and unveiled a new product with new technology for the physical design of ICs at 90 nanometers and below. The company formed in late 2003 and development on the EDA software was begun in 2004. The company has raised $14 million in two rounds of funding. Investors include the founding team, Acorn Campus Fund II, VCEDA, iD Innovation, Inc., and H&Q.

Other EDA News

Other IP & SoC News

« Previous Page 1 | 2 | 3 | 4  Next Page »

You can find the full EDACafe event calendar here.

To read more news, click here.

-- Jack Horgan, Contributing Editor.


Review Article Be the first to review this article

Downstream : Solutuions for Post processing PCB Designs

Featured Video
Currently No Featured Jobs
Upcoming Events
CDNLive Japan 2018 at The Yokohama Bay Hotel Tokyu Yokohama Japan - Jul 20, 2018
MAPPS 2018 Summer Conference at The Belmond Charleston Place Charleston SC - Jul 22 - 25, 2018
International Test Conference India 2018 at Bangalore India - Jul 22 - 24, 2018
SRTC-2018 at The Leela Ambience Gurugram NEW DELHI India - Jul 25 - 26, 2018
DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: UltraPLL

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise