September 17, 2007
Agilent EEsof, High Frequency Leader
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Jack Horgan - Contributing Editor

by Jack Horgan - Contributing Editor
Posted anew every four weeks or so, the EDA WEEKLY delivers to its readers information concerning the latest happenings in the EDA industry, covering vendors, products, finances and new developments. Frequently, feature articles on selected public or private EDA companies are presented. Brought to you by EDACafe.com. If we miss a story or subject that you feel deserves to be included, or you just want to suggest a future topic, please contact us! Questions? Feedback? Click here. Thank you!

Other IP & SoC News


    • Redefining the Architecture of Memory (New York Times)
    • Jazz Semiconductor Announces Analog-Intensive Mixed-Signal (AIMS) Initiative  
    • STMicroelectronics Introduces Next-Generation Secure MCUs Based On 0.13-Micron Process Technology
    • IPextreme Aligns With Infineon to Open and Promote Valuable MLI and MSC Interface Standards Specifications  
    • Broadcom Delivers Flexible New Wi-Fi(R) Workhorse That Slashes Cost, Size and Power for PCs, Broadband Gateways and Gaming Platforms 
    • NVIDIA Quadro FX 5600 Architecture Now Available Top-To-Bottom
    • TI Delivers SimpliciTI(TM) Network Protocol for Simple, Low-Power RF Networks 
    • Atmel's AT90SC256144RCFT Secure Microcontroller Qualified by FIME for ePassport Applications 
    • ChipMOS FILES PATENT INFRINGEMENT SUIT AGAINST WALTON CHAINTECH CORPORATION
    • New IBM Technology Enables Single-Chip Mobile Solutions
    • Samsung Introduces 60nm-class Processing for 2Gb DDR2 DRAM 
    • NANOIDENT Developer to Speak about the Next Generation of Printed Lab-on-a-Chip Devices at SPIE Europe Security & Defence 2007  
    • ARC Signs Licensing Agreement for Configurable Solutions For Next-Generation Computing Products
    • Xilinx and Barco Announce Single-Chip JPEG2000 Implementation 
    • Intelleflex Unveils Strategic Partner Program to Deliver Extended Capability RFID Solutions  
    • TI Updates Third-Quarter 2007 Business Outlook
    • FSA Releases Hard Intellectual Property Quality Risk Assessment Tool Version 3.0  
    • Explore Why the NAND Technology Market Has Grown to Sales of $16 Billion in Less Than Ten Years  
    • BiTMICRO to Debut 416GB IDE Flash Solid State Disk Packed in 2.5-Inch Rugged Hard Disk Drive Footprint
    • Jungo and Atheros Unveil Draft 2.0 802.11n Reference Designs for High Speed Residential and Business Gateways
    • Fujitsu Developing ASICs for GPS Receivers with Industry Leader NovAtel
    • ANADIGICS Ships 802.11n Power Amplifiers to NXP Semiconductor for WLAN Module Solution
    • Mixel Announces Two New PLLs Featuring Higher Performance, Reduced Power, Cost and Die Area at the 2007 FSA Expo and Conference
    • Aviza Technology and Mosel Vitelic Corporation Announce Joint Development Program
    • Xilinx XtremeDSP Solutions Enable Canopus High Definition Digital Recording System From Thomson
    • AMBARELLA UNVEILS INDUSTRY'S FIRST SINGLE-CHIP 1080P60 "FULL HD" BROADCAST ENCODER PLATFORM
    • OKI Ships Samples of ML7246, an IEEE802.15.4 Wireless LSI Equipped With USB Interface
    • Conexant's HDTV Video Decoders Win 'Best Silicon Innovation' in Annual Cable and Satellite Award Competition    
    • ViXS Launches New HD AVC Video Processor Family    
    • Intersil Corporation Acquires Planet ATE, Supplier of the World's Most Highly-Integrated Analog Pin Electronics for IC Test Equipment    
    • Arrow North American Components and IBM Collaborate On Advanced Chip Design and Manufacturing Services  
    • New RF Synthesizer with Integrated VCOs from STMicroelectronics Stretches Out to 5GHz
    • Intel Updates Third-Quarter Revenue and Gross Margin Expectations  
    • Top Layer Networks To Develop Next-Generation Network Security Solutions Using Newly-Unveiled TILE64 Multi-Core Chips from Tilera Corporation
    • Samsung 64GB Solid State Drives Now Shipping  
    • TI Boosts Portable Audio Performance With 2.7-W Constant Output Power Class-D Amplifier    
    • Atmel's UHF ASK/FSK Receiver ICs for TPMS and RKE Applications Provide Best Trade-off between High Integration, High Performance and Worldwide Frequency Coverage   style="FONT-SIZE: 9pt; COLOR: black; FONT-FAMILY: Verdana; mso-fareast-font-family: 'Times New Roman'; mso-bidi-font-family: 'Times New Roman'; mso-ansi-language: EN-US; mso-fareast-language: EN-US; mso-bidi-language: AR-SA">  
    • RadiSys Enters Into Agreement to Acquire Intel's Modular Communications Platforms ATCA, CPCI, & Legacy Business Assets  
    • Gateway Servers to Offer New Quad-Core AMD Opteron(TM) Processors    
    • Lattice Delivers Industry's Lowest Power, Smallest Footprint Programmable Bridge Solution    
    • Conexant Delivers Industry's Lowest Power, Single-Chip 802.11n Product Family
    • Freescale 8-bit, 8-pin Device for Entry-Level Automotive Applications Delivers Small Footprint, High Integration    
    • Sequans Introduces the Industry's First MAC/PHY Chip for Mobile WiMAX Base Stations  
    • ApaceWave Introduces the APW-2000 Mobile WiMAX Wave 2 Baseband SoC  
    • AMD Introduces the World's Most Advanced x86 Processor, Designed for the Demanding Datacenter  
    • Xilinx FPGAs and Design Tools Enable Echolab's Latest Multi-Definition Video Switcher



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    -- Jack Horgan, EDACafe.com Contributing Editor.

    Rating:
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    • informative article July 16, 2008
      Reviewed by 'Ranganath'
      Interesting article. Recommended for those wish to know about Agilent Eesof business.

        Was this review helpful to you?   (Report this review as inappropriate)


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