June 18, 2007
DAC 2007 – Perceptions of Primacy in Pleasantville
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Peggy Aycinena - Contributing Editor


by Peggy Aycinena - Contributing Editor
Posted anew every four weeks or so, the EDA WEEKLY delivers to its readers information concerning the latest happenings in the EDA industry, covering vendors, products, finances and new developments. Frequently, feature articles on selected public or private EDA companies are presented. Brought to you by EDACafe.com. If we miss a story or subject that you feel deserves to be included, or you just want to suggest a future topic, please contact us! Questions? Feedback? Click here. Thank you!


XYALIS announced an “advanced methodology” for building CMP models through a collaboration with CIMA-Nanotech, and says it will be able to provide “high-accuracy thickness measurements” on wafers. Per the Press Release, “Thanks to ‘non destructive’ nanometric measurement equipment's, XYALIS is able to build CMP models … for estimating the critical areas where dummy filling is needed to smooth the thickness variation. With advanced processes starting at 65 nanometers and below, using a model-based estimator is a must to find critical areas and reduce the number of dummy tiles inserted and reduce parasitics and yield lost.”


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Peggy Aycinena is Editor of EDA Confidential and Contributing Editor to EDA Weekly.




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-- Peggy Aycinena, EDACafe.com Contributing Editor.


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