February 27, 2006
Please Don't Take My Blackberry Away- RIM Vs NTP
Please note that contributed articles, blog entries, and comments posted on EDACafe.com are the views and opinion of the author and do not necessarily represent the views and opinions of the management and staff of Internet Business Systems and its subsidiary web-sites.
Jack Horgan - Contributing Editor


by Jack Horgan - Contributing Editor
Posted anew every four weeks or so, the EDA WEEKLY delivers to its readers information concerning the latest happenings in the EDA industry, covering vendors, products, finances and new developments. Frequently, feature articles on selected public or private EDA companies are presented. Brought to you by EDACafe.com. If we miss a story or subject that you feel deserves to be included, or you just want to suggest a future topic, please contact us! Questions? Feedback? Click here. Thank you!


Brion Delivers 'Accuracy Without Compromise' OPC Solution; Introduces Tachyon OPC+ for Accurate, Fast, Full-Chip Optical Proximity Correction Tachyon OPC+ delivers high-quality, accurate OPC features using the company's Focus Exposure Modeling (FEM) technology, an unprecedented one-model, through-process-window, full-chip lithography simulation capability that ensures OPC structures will function as designed. Tachyon OPC+ is currently in beta evaluation and production flow integration at Brion's existing customer base around the world.


Celoxica Strengthens DSP-FPGA Solutions; Joins Texas Instruments Third Party DSP Program; Celoxica ESL Design Technology Bridges Design Gap Between DSP and FPGA; Provides Direct Path From Software To Silicon Celoxica announced that it is joining the Texas Instruments Incorporated TMS320 third-party program and will present its DSP-FPGA design solutions during the 2006 TI Developer Conference (TIDC) in Dallas, Texas.




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-- Jack Horgan, EDACafe.com Contributing Editor.


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