January 23, 2006
Intel Unveils Brand New Image
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iPod range from $100 for the low end shuffle to $400 for the high end video version
The consumer electronics business is becoming more like the old safety razor business where you give away or discount the razor and make money on the blades. Over time households will buy more units and look for systems with boarder range of capabilities. They will be very interested in mobile systems with increased battery life to support anywhere and anytime use. They have already evidenced a willingness to pay for content and premium services.
Users of EDA tools are under substantial pressure to develop boarder products with new features, increased speed for downloading and streaming media, and increased storage capacity for both software and content. They must accomplish this within considerable time-to-market and cost constraints. Tools and methodologies that can address these challenges with minimal risk should be in high demand. One hurdle facing EDA vendors, particularly those offering new point tools, is to convince decision makers in prospect accounts that they can deliver on their product promises. In the CE arena missing a target market window by a little is the same as missing it altogether.
midquarter forecast. As a result the stock price dropped 11%.
The top articles over the last two weeks as determined by the number of readers were
European Project to Address Power Leakage in Digital SoCs A consortium of 14 partners, universities and research institutes from seven European countries has launched a project to enhance the design of the next generation of SoCs by addressing the key issues of leakage power in CMOS process of 65nm and below. Named CLEAN (Controlling Leakage power in NanoCMOS SoCs), the project is sponsored by the European Commission with a grant of 4.5 million euro, under the "Nanoelectronics" Strategic Objective of IST 6th Framework Programme.
Mentor Graphics Reports Preliminary 2005 Results; Fourth Quarter Revenue and Bookings Hit Records 234 Mentor announced that fourth quarter 2005 bookings and revenues achieved record levels. Revenues are expected to be in excess of $220 million, exceeding the Thomson First Call consensus estimate of $218 million. The company expects to be profitable for the quarter.
Sequence Low-Power Design Tools to Highlight Japan's EDSF At the upcoming Electronic Design and Solution Fair Sequence will exhibit its complete lineup of tools for low-power design, including PowerTheater, a complete toolkit for SoC power analysis and optimization; CoolPower, providing physical power optimization for leakage power, and dynamic power; and CoolTime, for static and dynamic power grid analysis and optimization.
Ponte Solutions Appoints Jerry Rau as Worldwide Sales VP Rau joins Ponte Solutions, Inc., the design-for-yield company. He has worked in EDA and semiconductor sales and marketing roles for more than two decades, more than half of it with industry leader Synopsys.
Carbon Expands Sales Channel Into Taiwan Carbon Design Systems, a leader in virtual system prototyping, announced that Maojet Technology Corporation, an established EDA tool representative, will distribute Carbon's VSP product family in Taiwan
Other EDA News
Premiere of DesignCon 2006 Management Forum Addresses Critical Business Challenges in High Technology
Agilent Technologies Announces Plans to Expand EDA Product Portfolio to Include 3D Electromagnetic Simulation
Mentor Graphics Provides Platform Express Solution for LSI Logic RapidChip Platform ASIC Partner Program
NEC Compound Semiconductor Devices Ltd. and Ansoft Deliver New Device Library; Library Includes Transistor Models for Nexxim and S-parameter Models and Device Footprints for Nexxim and Ansoft Designer
Celoxica Delivers Support for IEEE SystemC 2.1; Latest Release of Celoxica's Agility Compiler For SystemC Provides SystemC 2.1 Language Support, Comprehensive TLM Synthesis and Ease-Of-Use
Bluespec Joins The SPIRIT Consortium to Advance IP Reuse Interoperability Standards for SoC Design; EDA Company Adds ESL Synthesis Expertise to Further Standards Development
Mentor Graphics Collaborates with AMD to Deliver PCB Reference Designs for AMD's Leading Microprocessors
MatrixOne's PLM Platform Helps Drive New Program Management for 3M Automotive; Automobile Supplier Uses MatrixOne PLM System to Manage Customer Requirements and Shorten Time to Market for Automotive Projects
VIA Tapes Out 90-Nanometer Designs with Cadence Encounter Digital IC Design Platform; VIA Tapes Out One of the Region's First 90-Nanometer Designs for VIA/S3 Graphics with Highly Integrated Encounter Flow
Cadence Selected by MIET to Ramp Up Russian Startup Ecosystem; Moscow Institute of Electronic Technology Inaugurates Design Center to Develop and Fuel the Russian Electronics Industry
THine Electronics Adopts Berkeley Design Automation's PLL Noise Analyzer(TM) For Design of Digital Consumer Multimedia ICs
MatrixOne Allows Organizations to Transform Existing Knowledge into Traceable, Reusable Intellectual Capital; Library Central Solution Helps Create a Company-wide Knowledge Base and Organize Information into Specific Knowledge Catalogs
AWR Announces VSS 2006 for Design of Next-Generation Communications Products; RFIC and Fixed-Point Design Capabilities Radically Enhanced to Support Increasingly Complex Needs of Fast Growth Wireless Markets
Other IP & SoC News
Rambus Reports Fourth Quarter Earnings; Earnings Per Share of 9 Cents; Revenue Growth of 8% from the Fourth Quarter Last Year
Microchip Technology Announces Record Sales and Net Income for Third Quarter Fiscal Year 2006 and Record Quarterly Cash Dividend
Broadcom Delivers Industry's First Wi-Fi(R) Solutions Designed to Comply With IEEE 802.11n Draft Specification
Tripath Updates First Quarter Fiscal 2006 Revenue Expectations from $3.1 to $3.4 Million; Conference Call Scheduled for February 2, 2006
Cypress Introduces Low-Power, Low-Cost Interconnect Solutions for Leading-Edge Consumer Electronics Products
TriAccess Technologies, Inc. Introduces First Fiber-to-the-Home Gigabit Passive Optical Networking (GPON/GEPON) RFIC Family for Video ONUs
WJ Communications Introduces High Linearity, Variable Gain Amplifier for Mobile Infrastructure Applications
STMicroelectronics and Veredus Laboratories Team to Diagnose Avian Flu Using Rapid-Detection Point-of-Need Lab-on-Chip
Linear Technology Reports Increased Quarterly Sales and Profits and Increases Its Quarterly Cash Dividend 50% From $0.10 To $0.15 Per Share
Intel Fourth-Quarter Revenue $10.2 Billion; EPS 40 Cents; Record Quarterly and Annual Revenue and Operating Income; Record Quarterly Unit Shipments of Mobile, Desktop and Server Microprocessors
TeamF1 and AMCC Announce Alliance to Deliver Advanced Wireless and Security Solutions; Joint Effort Speeds Customers' Time-to-Market With Comprehensive Integrated Platforms
AMI Semiconductor Adds Echo Cancellation to Audio Processing Technology Portfolio; New Algorithm Available for Ultra-Low Power BelaSigna(TM) Systems
Fairchild Semiconductor Announces Industry's Smallest Integrated Video/Filter Driver for Sending Video Images from Cell Phones to Larger Displays
Teknovus Introduces the TK3713, New EPON SoC with Breakthrough Power, Size and Cost; First Single-Chip IPTV-Ready ONU Simplifies Carrier Deployments
Leading Optical Chip and Module Manufacturers Announce the Addition of Optical Devices with SC Connector Interface to (XMD) MSA for TOSA/ROSA; MSA Enables Multiple Vendors to Produce 10 Gbit/s Pluggable Modules Based on a Unified Standard
TeleCIS Wireless Secures $10M in VC and Strategic Funding; Company Completes First Tranche of Series C Funding
California Micro Devices Introduces Ultra Low Capacitance Praetorian(TM) EMI Filter for High Speed Data Lines
TI Enhances DTV Audio Performance with New Generation of Efficient Stereo Class-D Audio Power Amplifiers
TSMC in Production with 80nm Process; Lithographic Shrink Provides Easy Path to Increased Profit for Customers
Freescale Broadens RF Power Transistor Options for WiMAX Base Stations; Wireless Infrastructure Industry's First LDMOS Transistors Designed to Meet Stringent WiMAX Demands Up To 3.8 GHz
Rambus Files Patent Infringement Suit Against Micron; Delaware Judge Lifts Stay Permitting New Case to Move Forward Asserting Additional Patents on DDR2, GDDRx and Other Memory Products
Peregrine Semiconductor Extends 3G Handset Switch Offering; PE42671 UltraCMOS(TM) SP7T RF Switch Features Four TX Paths
Toshiba Expands Media Player LSI Product Line With Two New Single-Chip CD-MP3 Processors for Car-Audio Market
National Semiconductor Introduces Industry's First Single-Chip, Power over Ethernet Device Controller Designed for Low-Voltage Auxiliary Power Sources
IDT Enables Higher Performance in IP-Based Networks With Industry's First Statistics Engine; Off-the-Shelf Device Improves Network Processor Cycle Requirements by up to 90 Percent
Europractice and UMC Offer 90nm Multi-Project Wafer Prototyping and Production Service; Europractice Brings UMC's 90nm Logic and Mixed/RF Technology Within Reach of European Start-Up Companies and Academia
Agere Systems Introduces USB 2.0 Chip That Processes Data More Than Three Times Faster Than Alternative USB 2.0 Device Microcontrollers
Texas Instruments Extends Battery Life of Portable Applications with Easy-To-Use, Fully-Integrated DSP Power Management Tools
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-- Jack Horgan, EDACafe.com Contributing Editor.
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