October 24, 2005
TCAD - Technology CAD
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CEVA Xpert-Teak DSP Subsystem Powers National Semiconductor's New CP3SP33 Telematics Chip Targeting Analog-Rich Automotive Multimedia Applications
Cypress Introduces World's First Industrial Grade High-Speed USB 2.0 Microcontroller; New Offering Supports Temperature Range of -40 Degrees C to +105 Degrees C for Industrial, Automotive and Military Applications
FSA Announces 2005 FSA Suppliers Expo Taiwan & Semiconductor Leaders Forum; Second Annual Event to Feature Four Keynote Presenters
Toshiba Expands White LED Driver Product Line With White LED Driver IC That Powers Up to 8 LEDs in Series
SafeNet Announces Security Processor for SME Networking Equipment; SafeXcel-5150 is the First Security Processor Purpose-Built for Fast Ethernet Bandwidth
National Semiconductor Samples Industry's Lowest-Wire-Count LVDS Chipset for Flat Panel Displays in Automotive, Industrial and Security Applications
Linear Technology Reports Increased Sales and Pro Forma Profits Over The Similar Quarter In The Prior Year
Intel Announces Record Revenue of $9.96 Billion; EPS of 32 Cents Includes Legal Settlement that Lowered EPS by Approximately 2 Cents
Ember Ships Samples of ZigBee System-on-a-Chip; Combo 802.15.4 Radio and 16-Bit ZigBee Processor Chip Sends Packets More Than Twice as Far as Competitors
LSI Logic RapidChip(R) Technology Breaks $10 Barrier for Custom Single-Chip PCI Express Applications
Atmel's RF Tuner T4260 Supported by TI to Expand Developer Flexibility, and to Reduce Cost for HD Radio Receivers
TI Introduces 50 Percent Smaller, Pb-Free, Boost and Buck-Boost Power Modules with Wide Output Voltage Range
Two New 16 Channel High Voltage Analog Switches From Supertex Deliver Improved Density and Performance
STMicroelectronics Delivers Single-Chip Power Management Solution for Notebook PCs and Portable Systems
IC Interconnect Announces New Wire-Bonding Process for High-Temperature Applications; Electroless Ni/Immersion Au Process Receives Positive Customer Reviews as a Wire Bond Surface after Rigorous Testing
SEQUANS Communications Announces Availability of Its First System-on-Chips for WiMAX Subscriber Stations and Base Stations
ChipX Announces New Structured ASIC Family with Embedded PCI Express PHY; Silicon-proven PCIe Subsystem Offers High Performance, Low Risk Alternative to Traditional ASIC, FPGA Options
Ziptronix Revolutionizes Chip Interconnect for Three-Dimensional Integrated Circuits; New technology spurs greater integration, higher performance, and a scalable methodology to enable more than 4 million connections between bonded chips
X-EMI Adds Quad and Octal PCI Express Clock Buffers to Product Portfolio, Hits Taiwanese Market at Intel Developers Forum
Atheros Single-Chip Technology for PCI Express WLANs Debuts in Lighter, Faster, Feature-Rich Notebooks
Conexant Introduces ADSL2plus Chipset with Integrated Voice and Support for High-Speed USB 2.0 Peripherals; New Device Provides Migration Path to VDSL2 and Enables WLAN Performance Improvements
Agere Systems Announces Chipset Solution for Mainstream Mobile Phones Capable of Cinema-Quality Video and CD-Quality Sound
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-- Jack Horgan, EDACafe.com Contributing Editor.
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